Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811366 | Microelectronic bond pads having integrated spring structures | Feras Eid, Robert L. Sankman | 2020-10-20 |
| 10531575 | Systems and methods for replaceable bail grid array (BGA) packages on board substrates | Timothy Swettlen | 2020-01-07 |