Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777413 | Interconnects with non-mandrel cuts formed by early block patterning | Yuping Ren, Guoxiang Ning, Sunil Kumar Singh | 2020-09-15 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Ravi Prakash Srivastava, Zhiguo Sun, Qiang Fang, Cheng Xu +1 more | 2020-09-08 |
| 10714376 | Method of forming semiconductor material in trenches having different widths, and related structures | Chih-Chiang Chang, Haifeng Sheng, Jiehui Shu, Pei Liu, Jinping Liu +2 more | 2020-07-14 |
| 10644156 | Methods, apparatus, and system for reducing gate cut gouging and/or gate height loss in semiconductor devices | Jinsheng Gao, Daniel Jaeger, Michael V. Aquilino, Patrick Carpenter, Xusheng Wu | 2020-05-05 |
| 10586860 | Method of manufacturing finfet devices using narrow and wide gate cut openings in conjunction with a replacement metal gate process | Jiehui Shu, Laertis Economikos, Xusheng Wu, John H. Zhang, Hui Zhan +4 more | 2020-03-10 |
| 10559470 | Capping structure | Jinsheng Gao, Hong Yu, Jinping Liu, Huang Liu | 2020-02-11 |
| 10529831 | Methods, apparatus, and system for forming epitaxial formations with reduced risk of merging | Qun Gao, Matthew W. Stoker | 2020-01-07 |