Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784195 | Electrical fuse formation during a multiple patterning process | Jiehui Shu, Xiaoqiang Zhang, Haizhou Yin, Moosung Chae, Hui Zang | 2020-09-22 |
| 10714376 | Method of forming semiconductor material in trenches having different widths, and related structures | Chih-Chiang Chang, Haifeng Sheng, Jiehui Shu, Haigou Huang, Pei Liu +2 more | 2020-07-14 |
| 10622463 | Method, apparatus and system for improved performance using tall fins in finFET devices | Hui Zang, Min-hwa Chi | 2020-04-14 |
| 10586860 | Method of manufacturing finfet devices using narrow and wide gate cut openings in conjunction with a replacement metal gate process | Jiehui Shu, Laertis Economikos, Xusheng Wu, John H. Zhang, Haigou Huang +4 more | 2020-03-10 |
| 10566195 | Multiple patterning with variable space mandrel cuts | Jiehui Shu, Rui Chen | 2020-02-18 |
| 10559470 | Capping structure | Haigou Huang, Jinsheng Gao, Hong Yu, Huang Liu | 2020-02-11 |
| 10535771 | Method for forming replacement air gap | Laertis Economikos, Shesh Mani Pandey, Hui Zang, Haiting Wang | 2020-01-14 |