Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777413 | Interconnects with non-mandrel cuts formed by early block patterning | Guoxiang Ning, Haigou Huang, Sunil Kumar Singh | 2020-09-15 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Haigou Huang, Ravi Prakash Srivastava, Zhiguo Sun, Qiang Fang, Cheng Xu +1 more | 2020-09-08 |
| 10600914 | Isolation pillar first gate structures and methods of forming same | Wei Zhao, Ming Hao Tang, Haiting Wang, Rui Chen, Hui Zang +2 more | 2020-03-24 |
| 10566291 | Mark structure for aligning layers of integrated circuit structure and methods of forming same | Ming Hao Tang, Rui Chen, Bradley Morgenfeld, Zheng Chen | 2020-02-18 |