Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832944 | Interconnect structure having reduced resistance variation and method of forming same | Chanro Park, Ruilong Xie, Andre P. Labonte | 2020-11-10 |
| 10818494 | Metal on metal multiple patterning | Hsueh-Chung Chen, Ravi Prakash Srivastava, Somnath Ghosh, Terry A. Spooner, Sean Reidy | 2020-10-27 |
| 10770392 | Line end structures for semiconductor devices | Shao Beng Law | 2020-09-08 |
| 10707119 | Interconnect structures with airgaps and dielectric-capped interconnects | Jeremy A. Wahl, Vimal Kamineni | 2020-07-07 |
| 10677855 | Structure, method and system for measuring RIE lag depth | — | 2020-06-09 |
| 10622266 | Methods of identifying space within integrated circuit structure as mandrel space or non-mandrel space | Erik Verduijn, Genevieve Beique, Lei Sun, Francis Goodwin | 2020-04-14 |
| 10580696 | Interconnects formed by a metal displacement reaction | Sean Xuan Lin, Christian Witt, Mark V. Raymond, Errol Todd Ryan | 2020-03-03 |