| 10840373 |
Integration of input/output device in vertical field-effect transistor technology |
Xuefeng Liu, Junli Wang, Brent A. Anderson, Gauri Karve |
2020-11-17 |
| 10833069 |
Logic gate designs for 3D monolithic direct stacked VTFET |
Chen Zhang, Tenko Yamashita |
2020-11-10 |
| 10748901 |
Interlayer via contacts for monolithic three-dimensional semiconductor integrated circuit devices |
Joshua M. Rubin, Nicolas Loubet |
2020-08-18 |
| 10741544 |
Integration of electrostatic discharge protection into vertical fin technology |
Brent A. Anderson, Huiming Bu, Xuefeng Liu, Junli Wang |
2020-08-11 |
| 10700209 |
Independent gate FinFET with backside gate contact |
Joshua M. Rubin, Tenko Yamashita |
2020-06-30 |
| 10691870 |
Checking wafer-level integrated designs for rule compliance |
Larry Wissel |
2020-06-23 |
| 10629443 |
Bottom source/drain silicidation for vertical field-effect transistor (FET) |
Brent A. Anderson, Huiming Bu, Fee Li Lie, Junli Wang |
2020-04-21 |
| 10615027 |
Stack viabar structures |
Su Chen Fan, Hsueh-Chung Chen, Yann Mignot, James J. Kelly |
2020-04-07 |
| 10615276 |
Integration of input/output device in vertical field-effect transistor technology |
Xuefeng Liu, Junli Wang, Brent A. Anderson, Gauri Karve |
2020-04-07 |
| 10607938 |
Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices |
Joshua M. Rubin |
2020-03-31 |
| 10608080 |
Bulk to silicon on insulator device |
Joshua M. Rubin, Tenko Yamashita |
2020-03-31 |
| 10607992 |
Semiconductor device and method of forming the semiconductor device |
Brent A. Anderson, Shawn P. Fetterolf |
2020-03-31 |
| 10586854 |
Gate-all-around field effect transistor having multiple threshold voltages |
Ruqiang Bao, Michael A. Guillorn, Robert R. Robison, Reinaldo Vega, Tenko Yamashita |
2020-03-10 |
| 10566453 |
Vertical transistor contact for cross-coupling in a memory cell |
Brent A. Anderson, Junli Wang |
2020-02-18 |
| 10559670 |
Nanosheet field effect transistors with partial inside spacers |
Michael A. Guillorn, Robert R. Robison, Reinaldo Vega, Rajasekhar Venigalla |
2020-02-11 |
| 10559572 |
Vertical transistor contact for a memory cell with increased density |
Brent A. Anderson, Junli Wang |
2020-02-11 |
| 10546787 |
Multi-metal dipole doping to offer multi-threshold voltage pairs without channel doping for highly scaling CMOS device |
Ruqiang Bao, Vijay Narayanan, Hemanth Jagannathan |
2020-01-28 |
| 10541253 |
FinFETs with various fin height |
Kangguo Cheng, Xin Miao, Balasubramanian Pranatharthiharan |
2020-01-21 |
