| 10879107 |
Method of forming barrier free contact for metal interconnects |
Ekmini Anuja De Silva, Jennifer Church, Luciana Meli Thompson |
2020-12-29 |
| 10833258 |
MRAM device formation with in-situ encapsulation |
Chih-Chao Yang, Daniel C. Edelstein, Karthik Yogendra, John C. Arnold |
2020-11-10 |
| 10833257 |
Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts |
John C. Arnold, Chih-Chao Yang, Theodorus E. Standaert |
2020-11-10 |
| 10796911 |
Hardmask stress, grain, and structure engineering for advanced memory applications |
Michael Rizzolo, Oscar van der Straten, Chih-Chao Yang |
2020-10-06 |
| 10707413 |
Formation of embedded magnetic random-access memory devices |
Chih-Chao Yang, John C. Arnold, Michael Rizzolo, Jon Slaughter |
2020-07-07 |
| 10685879 |
Lithographic alignment of a conductive line to a via |
John C. Arnold, Dominik Metzler, Takeshi Nogami |
2020-06-16 |
| 10672618 |
Systems and methods for patterning features in tantalum nitride (TaN) layer |
Vinh Luong, Isabel Cristina Chu |
2020-06-02 |
| 10672611 |
Hardmask stress, grain, and structure engineering for advanced memory applications |
Michael Rizzolo, Oscar van der Straten, Chih-Chao Yang |
2020-06-02 |
| 10656527 |
Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer |
Ekmini Anuja De Silva, Indira Seshadri, Jing Guo, Nelson Felix |
2020-05-19 |
| 10615037 |
Tone reversal during EUV pattern transfer using surface active layer assisted selective deposition |
Ekmini Anuja De Silva, Luciana Meli Thompson |
2020-04-07 |
| 10539884 |
Post-lithography defect inspection using an e-beam inspection tool |
Luciana Meli Thompson, Ekmini Anuja De Silva |
2020-01-21 |
