Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734475 | Stacked MIM capacitors with self-aligned contact to reduce via enclosure | Takashi Ando, Hemanth Jagannathan, Lawrence A. Clevenger, Griselda Bonilla | 2020-08-04 |
| 10714420 | High cutoff frequency metal-insulator-metal capacitors implemented using via contact configurations | Joshua M. Rubin, Joel A. Silberman | 2020-07-14 |
| 10643790 | Manufacturing method for 3D multipath inductor | Sarath L. K. Parambil, Venkata Nr. Vanukuru | 2020-05-05 |