Issued Patents 2020
Showing 76–80 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10545806 | Proximity correction in three-dimensional manufacturing | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-01-28 |
| 10541206 | Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2020-01-21 |
| 10535608 | Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate | Joshua M. Rubin, Charles L. Arvin | 2020-01-14 |
| 10529662 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Hosadurga Shobha | 2020-01-07 |
| 10529569 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2020-01-07 |