Issued Patents All Time
Showing 101–125 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6209484 | Method and apparatus for depositing an etch stop layer | Judy H. Huang, Wai-Fan Yau, David Cheung | 2001-04-03 |
| 6197698 | Method for etching a poly-silicon layer of a semiconductor wafer | Jui-Tsen Huang, Kuang-Hua Shih, Tsu-An Lin | 2001-03-06 |
| 6194325 | Oxide etch process with high selectivity to nitride suitable for use on surfaces of uneven topography | Jeffrey Marks, Nicolas Bright, Kenneth S. Collins, David W. Groechel, Peter Keswick | 2001-02-27 |
| 6184147 | Method for forming a high aspect ratio borderless contact hole | Tong-Yu Chen, Keh-Ching Huang | 2001-02-06 |
| 6184142 | Process for low k organic dielectric film etch | Hsien-Ta Chung, Tong-Yu Chen, Tri-Rung Yew | 2001-02-06 |
| 6184150 | Oxide etch process with high selectivity to nitride suitable for use on surfaces of uneven topography | Mei Chang, Paul Arleo, Haojiang Li, Hyman J. Levinstein | 2001-02-06 |
| 6180532 | Method for forming a borderless contact hole | Tong-Yu Chen, Tsu-An Lin | 2001-01-30 |
| 6171974 | High selectivity oxide etch process for integrated circuit structures | Jeffrey Marks, Jerry Wong, David W. Groechel, Peter Keswick | 2001-01-09 |
| 6165375 | Plasma etching method | Usha Raghuram, Kimberley A. Kaufman, Daniel Arnzen, James E. Nulty | 2000-12-26 |
| 6147007 | Method for forming a contact hole on a semiconductor wafer | Wei-Che Huang, Tong-Yu Chen | 2000-11-14 |
| 6139702 | Seasoning process for etcher | Tong-Yu Chen, Michael W C Huang | 2000-10-31 |
| 6127262 | Method and apparatus for depositing an etch stop layer | Judy H. Huang, Wai-Fan Yau, David Cheung | 2000-10-03 |
| 6083845 | Etching method | Tong-Yu Chen | 2000-07-04 |
| 6068784 | Process used in an RF coupled plasma reactor | Kenneth S. Collins, Craig A. Roderick, John Trow, Jerry Wong, Jeffrey Marks +6 more | 2000-05-30 |
| 6036877 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, David W. Groechel, Gerald Yin, Jon Mohn +5 more | 2000-03-14 |
| 6024826 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, David W. Groechel, Gerald Yin, Jon Mohn +5 more | 2000-02-15 |
| 6010968 | Method for forming a contact opening with multilevel etching | Tong-Yu Chen, Keh-Ching Huang | 2000-01-04 |
| 5994233 | Oxide etching method | Tong-Yu Chen, Tsu-An Lin | 1999-11-30 |
| 5990017 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, David W. Groechel, Gerald Yin, Jon Mohn +5 more | 1999-11-23 |
| 5888414 | Plasma reactor and processes using RF inductive coupling and scavenger temperature control | Kenneth S. Collins, Jerry Wong, Jeffrey Marks, Peter Keswick, David W. Groechel | 1999-03-30 |
| 5556501 | Silicon scavenger in an inductively coupled RF plasma reactor | Kenneth S. Collins, Craig A. Roderick, John Trow, Jerry Wong, Jeffrey Marks +7 more | 1996-09-17 |
| 5423945 | Selectivity for etching an oxide over a nitride | Jeffrey Marks, Kenneth S. Collins, David W. Groechel, Peter Keswick | 1995-06-13 |
| 5312778 | Method for plasma processing using magnetically enhanced plasma chemical vapor deposition | Kenneth S. Collins, John M. White | 1994-05-17 |
| 5300460 | UHF/VHF plasma for use in forming integrated circuit structures on semiconductor wafers | Kenneth S. Collins, Craig A. Roderick, David N. Wang, Dan Maydan | 1994-04-05 |
| 5210466 | VHF/UHF reactor system | Kenneth S. Collins, Craig A. Roderick, David N. Wang, Dan Maydan | 1993-05-11 |