Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Wei-Yu Chen | 2023-09-05 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Wei-Yu Chen | 2023-07-18 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Jiun Yi Wu | 2023-06-27 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2023-03-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Jiun Yi Wu | 2023-02-28 |
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2022-11-29 |
| 11508640 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2022-08-23 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2022-06-07 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Wei-Yu Chen | 2022-04-26 |
| 11282761 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2022-03-22 |
| 11282779 | Package structure and fabricating method thereof | Kai-Chiang Wu, Jiun Yi Wu | 2022-03-22 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2022-03-01 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang | 2022-02-08 |
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2021-12-28 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Jung Wei Cheng, Chien-Hsun Lee | 2021-09-21 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2021-08-24 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2021-06-01 |
| 10957672 | Package structure and method of manufacturing the same | Chi-Yang Yu, Chin-Liang Chen, Chien-Hsun Lee, Kuan-Lin Ho | 2021-03-23 |
| 10867947 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chen-Hua Yu | 2020-12-15 |
| 10804192 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2020-10-13 |
| 10804245 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2020-10-13 |
| 10790210 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chien-Hsun Lee | 2020-09-29 |
| 10700034 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2020-06-30 |