Issued Patents All Time
Showing 76–84 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425117 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Guan-Yu Chen, Tin-Hao Kuo, Chen-Shien Chen | 2016-08-23 |
| 9425157 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2016-08-23 |
| 9418928 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2016-08-16 |
| 9337135 | Pop joint through interposer | Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2016-05-10 |
| 9305890 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Yu-Feng Chen | 2016-04-05 |
| 9275967 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2016-03-01 |
| 9153550 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Guan-Yu Chen, Tin-Hao Kuo, Chen-Shien Chen | 2015-10-06 |
| 9153528 | Chip package and method for forming the same | Po-Shen Lin, Tsang-Yu Liu, Yen-Shih Ho, Chih-Wei Ho | 2015-10-06 |
| 8779452 | Chip package | Tzu-Hsiang Hung, Hsin-Chih Chiu, Chuan-Jin Shiu, Chia-Sheng Lin, Yen-Shih Ho | 2014-07-15 |