Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700031 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2020-06-30 |
| 10658263 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Wen-Lin Chen | 2020-05-19 |
| 10622278 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2020-04-14 |
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Jung Wei Cheng, Chien-Hsun Lee | 2019-12-31 |
| 10522495 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2019-12-31 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10276508 | Semiconductor packages and methods of forming the same | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu | 2019-04-30 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2019-04-23 |
| 10163768 | Semiconductor structure and method of manufacturing the same | Jiun Yi Wu | 2018-12-25 |
| 10163774 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2018-12-25 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2018-12-18 |
| 10141281 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2018-11-27 |
| 10128195 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Guan-Yu Chen, Tin-Hao Kuo, Chen-Shien Chen | 2018-11-13 |
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Jung Wei Cheng, Tsung-Ding Wang | 2018-11-13 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2018-08-14 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Chun-Hung Lin | 2018-07-10 |
| 10014270 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2018-07-03 |
| 9941186 | Method for manufacturing semiconductor structure | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2018-04-10 |
| 9917068 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Jung Wei Cheng, Tsung-Ding Wang | 2018-03-13 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2018-01-09 |
| 9768090 | Substrate design for semiconductor packages and method of forming same | Mirng-Ji Lii, Jiun Yi Wu | 2017-09-19 |
| 9659881 | Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion | Jiun Yi Wu | 2017-05-23 |
| 9589924 | Semiconductor structure and method of manufacturing the same | Jiun Yi Wu | 2017-03-07 |
| 9559076 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Yu-Feng Chen | 2017-01-31 |
| 9508637 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Chun-Hung Lin | 2016-11-29 |