Issued Patents All Time
Showing 151–175 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11329006 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2022-05-10 |
| 11328971 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai +1 more | 2022-03-22 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2022-03-22 |
| 11264300 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang | 2022-03-01 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Shin-Puu Jeng | 2022-03-01 |
| 11164754 | Fan-out packages and methods of forming the same | Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang +2 more | 2021-11-02 |
| 11107801 | Multi fan-out package structure and method for forming the same | Shin-Puu Jeng, Shuo-Mao Chen, Feng-Cheng Hsu, Chia-Hsiang Lin | 2021-08-31 |
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2021-07-13 |
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2021-05-18 |
| 10867925 | Method for forming chip package structure | Shin-Puu Jeng, Shuo-Mao Chen, Feng-Cheng Hsu | 2020-12-15 |
| 10867924 | Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu | 2020-12-15 |
| 10854563 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2020-12-01 |
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Che-Chia Yang, Kuang-Chun Lee, Yu-Sheng Lin, Shin-Puu Jeng | 2020-09-29 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |
| 10714463 | Method of forming semicondcutor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10685920 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2020-06-16 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2020-05-26 |
| 10504880 | Method of forming semicondcutor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-04-30 |
| 10269602 | Wafer warpage inspection system and method using the same | Wen-Yi Lin, Shin-Puu Jeng | 2019-04-23 |
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2018-12-25 |
| 10109547 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2018-10-23 |
| 10008480 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2018-06-26 |