Issued Patents All Time
Showing 101–125 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854837 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Ming-Chih Yew, Chien-Sheng Chen, Shin-Puu Jeng | 2023-12-26 |
| 11855009 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2023-12-26 |
| 11855008 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-12-26 |
| 11855004 | Package structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Shin-Puu Jeng | 2023-12-26 |
| 11830859 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Po-Chen Lai, Shin-Puu Jeng | 2023-11-28 |
| 11830800 | Metallization structure and package structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Shin-Puu Jeng | 2023-11-28 |
| 11823991 | Frames stacked on substrate encircling devices and manufacturing method thereof | Chien-Hung Chen, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2023-11-21 |
| 11798897 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2023-10-24 |
| 11784061 | Chip package structure and method for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-10-10 |
| 11784130 | Structure and formation method of package with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2023-10-10 |
| 11784148 | Semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2023-10-10 |
| 11764169 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2023-09-19 |
| 11756854 | Package structure and method of fabricating the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-09-12 |
| 11756892 | Method for forming chip package structure | Shin-Puu Jeng, Shuo-Mao Chen, Feng-Cheng Hsu | 2023-09-12 |
| 11756873 | Semiconductor package and manufacturing method thereof | Chia-Kuei Hsu, Ming-Chih Yew, Tsung-Yen Lee, Shin-Puu Jeng | 2023-09-12 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Shin-Puu Jeng | 2023-09-05 |
| 11742322 | Integrated fan-out package having stress release structure | Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Shin-Puu Jeng | 2023-08-29 |
| 11728256 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2023-08-15 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee, Che-Chia Yang +2 more | 2023-08-15 |
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao +1 more | 2023-08-15 |
| 11721644 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Chen Lai, Shin-Puu Jeng | 2023-08-08 |
| 11721643 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh +1 more | 2023-08-08 |
| 11715731 | Package structure and method of forming the same | Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2023-08-01 |
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Tsung-Yen Lee, Chia-Kuei Hsu, Shang-Lun Tsai, Ming-Chih Yew | 2023-07-18 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee +1 more | 2023-07-18 |