Issued Patents All Time
Showing 76–100 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033906 | Semiconductor package and manufacturing method thereof | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033871 | Method for forming semiconductor die package with ring structure comprising recessed parts | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2024-07-09 |
| 12021014 | Bump joint structure with distortion and method forming same | Shin-Puu Jeng | 2024-06-25 |
| 12014969 | Package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Li-Ling Liao, Chin-Hua Wang, Shin-Puu Jeng | 2024-06-18 |
| 12009276 | Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2024-06-11 |
| 12009278 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Shin-Puu Jeng | 2024-06-11 |
| 11997842 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2024-05-28 |
| 11996346 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Hui Yu, Shyue-Ter Leu, Shin-Puu Jeng | 2024-05-28 |
| 11990418 | Chip package structure with buffer structure and method for forming the same | Chin-Hua Wang, Po-Chen Lai, Ping-Tai CHEN, Che-Chia Yang, Yu-Sheng Lin +1 more | 2024-05-21 |
| 11984381 | Semiconductor package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Chin-Hua Wang, Shin-Puu Jeng | 2024-05-14 |
| 11984378 | Semiconductor package structure and method for forming the same | Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2024-05-14 |
| 11978722 | Structure and formation method of package containing chip structure with inclined sidewalls | Shu-Shen Yeh, Po-Chen Lai, Che-Chia Yang, Li-Ling Liao, Shin-Puu Jeng | 2024-05-07 |
| 11973001 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2024-04-30 |
| 11967582 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Shin-Puu Jeng | 2024-04-23 |
| 11967547 | Solder resist structure to mitigate solder bridge risk | Chin-Hua Wang, Shu-Shen Yeh, Po-Chen Lai, Shin-Puu Jeng | 2024-04-23 |
| 11955455 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Chen Lai, Shu-Shen Yeh | 2024-04-09 |
| 11915992 | Method for forming package structure with lid | Shin-Puu Jeng, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang | 2024-02-27 |
| 11915991 | Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof | Shu-Shen Yeh, Yu-Sheng Lin, Po-Chen Lai, Shin-Puu Jeng | 2024-02-27 |
| 11908757 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Shin-Puu Jeng | 2024-02-20 |
| 11894320 | Semiconductor device package with stress reduction design and method of forming the same | Shu-Shen Yeh, Chin-Hua Wang, Po-Chen Lai, Shin-Puu Jeng | 2024-02-06 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2024-01-02 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Shin-Puu Jeng | 2024-01-02 |
| 11862580 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2024-01-02 |
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Shin-Puu Jeng | 2023-12-26 |
| 11854837 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Ming-Chih Yew, Chien-Sheng Chen, Shin-Puu Jeng | 2023-12-26 |