Issued Patents All Time
Showing 26–50 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322704 | Package structure with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2025-06-03 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Shin-Puu Jeng, Chia-Hsiang Lin | 2025-06-03 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Shin-Puu Jeng, Ming-Chih Yew +3 more | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng, Chien-Hung Chen +3 more | 2025-05-27 |
| 12308346 | Semiconductor die with tapered sidewall in package | Chin-Hua Wang, Shin-Puu Jeng, Po-Chen Lai, Shu-Shen Yeh, Ming-Chih Yew +1 more | 2025-05-20 |
| 12300568 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Chia-Kuei Hsu, Shin-Puu Jeng | 2025-05-13 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2025-05-13 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Shin-Puu Jeng | 2025-04-22 |
| 12278156 | Semiconductor package | Chin-Hua Wang, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2025-04-15 |
| 12266635 | Semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Shin-Puu Jeng | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Ming-Chih Yew, Che-Chia Yang, Po-Chen Lai, Shin-Puu Jeng | 2025-03-25 |
| 12255119 | Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Ming-Chih Yew, Shin-Puu Jeng | 2025-03-18 |
| 12255156 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Chen Lai, Shin-Puu Jeng | 2025-03-18 |
| 12255118 | Package structure and method of fabricating the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2025-03-18 |
| 12255078 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Ming-Chih Yew, Chien-Sheng Chen, Shin-Puu Jeng | 2025-03-18 |
| 12249568 | Metallization structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Shin-Puu Jeng | 2025-03-11 |
| 12243800 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang | 2025-03-04 |
| 12237276 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh +1 more | 2025-02-25 |
| 12237277 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2025-02-25 |
| 12232307 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2025-02-18 |
| 12218080 | Package structure with reinforced element | Shin-Puu Jeng, Shuo-Mao Chen, Chia-Hsiang Lin | 2025-02-04 |
| 12218023 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Shin-Puu Jeng | 2025-02-04 |
| 12191272 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Shin-Puu Jeng | 2025-01-07 |
| 12191294 | Package structure and method of forming the same | Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2025-01-07 |
| 12183714 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2024-12-31 |