Issued Patents All Time
Showing 126–150 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Shin-Puu Jeng | 2023-07-11 |
| 11699631 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Hui Yu, Shyue-Ter Leu, Shin-Puu Jeng | 2023-07-11 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Shin-Puu Jeng | 2023-07-04 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Shin-Puu Jeng | 2023-07-04 |
| 11682602 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2023-06-20 |
| 11676916 | Structure and formation method of package with warpage-control element | Yu-Sheng Lin, Chien-Hung Chen, Po-Chen Lai, Shin-Puu Jeng | 2023-06-13 |
| 11676826 | Semiconductor die package with ring structure for controlling warpage of a package substrate | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-06-13 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-06-06 |
| 11652037 | Semiconductor package and method of manufacture | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Shin-Puu Jeng | 2023-05-16 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Shin-Puu Jeng | 2023-04-25 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Shin-Puu Jeng | 2023-03-21 |
| 11605600 | Package structure with reinforced element and formation method thereof | Shin-Puu Jeng, Shuo-Mao Chen, Chia-Hsiang Lin | 2023-03-14 |
| 11600575 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2023-03-07 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Shin-Puu Jeng | 2023-02-28 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2023-02-07 |
| 11557559 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Shin-Puu Jeng | 2023-01-17 |
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2022-12-20 |
| 11532593 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Chen Lai, Shu-Shen Yeh | 2022-12-20 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Shin-Puu Jeng | 2022-12-13 |
| 11508710 | Method of forming semiconductor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2022-11-22 |
| 11488898 | Bump joint structure with distortion and method forming same | Shin-Puu Jeng | 2022-11-01 |
| 11456257 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu | 2022-09-27 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2022-09-20 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 11393746 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2022-07-19 |