Issued Patents All Time
Showing 176–200 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Cheng-Lin Huang, Shyue-Ter Leu, Shin-Puu Jeng | 2018-01-30 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng, Shyue-Ter Leu +2 more | 2018-01-16 |
| 9831190 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2017-11-28 |
| 9780076 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2017-10-03 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin +4 more | 2017-08-29 |
| 9721868 | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate | Wen-Yi Lin, Shyue-Ter Leu, Ming-Chih Yew, Shu-Shen Yeh | 2017-08-01 |
| 9653391 | Semiconductor packaging structure and manufacturing method thereof | Ming-Chih Yew, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2017-05-16 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jiun Yi Wu, Jing Ruei Lu, Ming-Chih Yew | 2017-02-28 |
| 9548281 | Electrical connection for chip scale packaging | Ming-Chih Yew, Wen-Yi Lin, Fu-Jen Li | 2017-01-17 |
| 9543284 | 3D packages and methods for forming the same | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu, Wen-Yi Lin | 2017-01-10 |
| 9515038 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Chia-Jen Cheng, Hsiu-Mei Yu | 2016-12-06 |
| 9502323 | Method of forming encapsulated semiconductor device package | Wen-Yi Lin, Kuo-Chuan Liu, Cheng-Yi Hong, Ming-Chih Yew | 2016-11-22 |
| 9502387 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2016-11-22 |
| 9252076 | 3D packages and methods for forming the same | Ming-Chih Yew, Wen-Yi Lin, Fu-Jen Li, Kuo-Chuan Liu | 2016-02-02 |
| 9237647 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2016-01-12 |
| 9087882 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Chia-Jen Cheng, Hsiu-Mei Yu | 2015-07-21 |
| 8976529 | Lid design for reliability enhancement in flip chip package | Wen-Yi Lin, Tsung-Shu Lin, Kuo-Chin Chang, Shou-Yi Wang | 2015-03-10 |
| 8970029 | Thermally enhanced heat spreader for flip chip packaging | Wen-Yi Lin | 2015-03-03 |
| 8946888 | Package on packaging structure and methods of making same | Wen-Yi Lin, Ming-Chih Yew, Jing Ruei Lu, Jiun Yi Wu | 2015-02-03 |
| 8941248 | Semiconductor device package and method | Wen-Yi Lin, Ming-Chih Yew, Cheng-Yi Hong, Kuo-Chuan Liu | 2015-01-27 |
| 8901732 | Semiconductor device package and method | Ming-Chih Yew, Fu-Jen Li, Wen-Yi Lin, Kuo-Chuan Liu | 2014-12-02 |
| 8847369 | Packaging structures and methods for semiconductor devices | Ming-Chih Yew, Wen-Yi Lin, Jiun Yi Wu | 2014-09-30 |
| 8779582 | Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas | Wen-Yi Lin | 2014-07-15 |
| 8624392 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Chia-Jen Cheng, Hsiu-Mei Yu | 2014-01-07 |
| 8462510 | Board-level package with tuned mass damping structure | Wen-Yi Lin | 2013-06-11 |