Issued Patents All Time
Showing 201–204 of 204 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8283777 | Compressive ring structure for flip chip packaging | Wen-Yi Lin | 2012-10-09 |
| 6819564 | Heat dissipation module | Chao-Tsai Chung, Cheng-Chen Cheng | 2004-11-16 |
| 6711016 | Side exhaust heat dissipation module | Chao-Tsai Chung | 2004-03-23 |
| 6188578 | Integrated circuit package with multiple heat dissipation paths | Ching-Bai Hwang | 2001-02-13 |