Issued Patents All Time
Showing 51–75 of 142 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7217663 | Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof | Yi-Chen Huang, Chien-Chung Fu, Ming-Hong Hsieh, Hui Ouyang, Yi-Nien Su | 2007-05-15 |
| 7208331 | Methods and structures for critical dimension and profile measurement | Jyu-Horng Shieh, Wen-Chih Chiou, Peng-Fu Hsu, Baw-Ching Perng, Chia-Jen Chen | 2007-04-24 |
| 7172933 | Recessed polysilicon gate structure for a strained silicon MOSFET device | Yi-Chun Huang, Bow-Wen Chan, Baw-Ching Perng, Lawrence Chiang Sheu, Chih-Hsin Ko +1 more | 2007-02-06 |
| 7148114 | Process for patterning high-k dielectric material | Hsien-Kuang Chiu, Baw-Ching Perng | 2006-12-12 |
| 7141460 | Method of forming trenches in a substrate by etching and trimming both hard mask and a photosensitive layers | Ming-Jie Huang | 2006-11-28 |
| 7122484 | Process for removing organic materials during formation of a metal interconnect | Baw-Ching Perng, Yi-Chen Huang, Jun-Lung Huang, Bor-Wen Chan, Peng-Fu Hsu +2 more | 2006-10-17 |
| 7115526 | Method for wet etching of high k thin film at low temperature | Hsieh Yue Ho, Chih-Cheng Wang, Hsiao Shih-Yi, Kang Tsung-Kuei, Bing-Yue Tsui +4 more | 2006-10-03 |
| 7115450 | Approach to improve line end shortening including simultaneous trimming of photosensitive layer and hardmask | Ming-Jie Huang | 2006-10-03 |
| 7109085 | Etching process to avoid polysilicon notching | Shiang-Bau Wang, Li-Te Lin, Ming-Ching Chang, Ryan Chia-Jen Chen, Yuan-Hung Chiu | 2006-09-19 |
| 7092096 | Optical scatterometry method of sidewall spacer analysis | Fang Chen | 2006-08-15 |
| 7078351 | Photoresist intensive patterning and processing | Yuan-Hung Chiu, Ming-Huan Tsai, Jeng-Horng Chen | 2006-07-18 |
| 7074727 | Process for improving dielectric properties in low-k organosilicate dielectric material | Peng-Fu Hsu, Jyu-Horng Shieh, Yung-Cheng Lu, Yuan-Hung Chiu | 2006-07-11 |
| 7067391 | Method to form a metal silicide gate device | Bor-Wen Chan, Chih-Hao Wang, Lawrance Hsu | 2006-06-27 |
| 7067235 | Bi-layer photoresist dry development and reactive ion etch method | Ming-Huan Tsai | 2006-06-27 |
| 7060628 | Method for fabricating a hard mask polysilicon gate | Ming-Jie Huang, Yuan-Hung Chiu | 2006-06-13 |
| 7037849 | Process for patterning high-k dielectric material | Hsien-Kuang Chiu, Baw-Ching Perng | 2006-05-02 |
| 7033518 | Method and system for processing multi-layer films | Hui Yang, Miao-Ju Hsu, Chao-Cheng Chen | 2006-04-25 |
| 7029992 | Low oxygen content photoresist stripping process for low dielectric constant materials | Jyu-Horng Shieh, Yi-Nien Su, Jang-Shiang Tsai, Chen-Nan Yeh | 2006-04-18 |
| 7022610 | Wet cleaning method to eliminate copper corrosion | Chun-Li Chou, Yih-Ann Lin, Yi-Chen Huang, Chao-Cheng Chen | 2006-04-04 |
| 7023042 | Method of forming a stacked capacitor structure with increased surface area for a DRAM device | Bor-Wen Chan, Huan-Just Lin | 2006-04-04 |
| 7008878 | Plasma treatment and etching process for ultra-thin dielectric films | Ju-Wang Hsu, Yuan-Hung Chiu | 2006-03-07 |
| 7008866 | Large-scale trimming for ultra-narrow gates | Ming-Jie Huang, Shu-Chih Yang, Huan-Just Lin, Yung-Tin Chen | 2006-03-07 |
| 6974730 | Method for fabricating a recessed channel field effect transistor (FET) device | Carlos H. Diaz, Yi-Ming Sheu, Syun-Ming Jang, Fu-Liang Yang | 2005-12-13 |
| 6969688 | Wet etchant composition and method for etching HfO2 and ZrO2 | Baw-Ching Perng, Fang Chen, Peng-Fu Hsu, Yue-Ho Hsieh, Chih-Cheng Wang +1 more | 2005-11-29 |
| 6914007 | In-situ discharge to avoid arcing during plasma etch processes | Ching-Hui Ma, Chao-Cheng Chen, Tsang-Jiuh Wu, Hui Yu | 2005-07-05 |