Issued Patents All Time
Showing 101–125 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627022 | Double pumped memory techniques | Andy Wangkun Chen, Sabarish Ittamveetil, Yew Keong Chong, Indranil Basu, Yew Keong Vikash | 2017-04-18 |
| 9627268 | Method for fabricating semiconductor device | Ching-Yu Chang, Li-Wei Feng, Shih-Hung Tsai, Ssu-I Fu, Jyh-Shyang Jenq +4 more | 2017-04-18 |
| 9554059 | Exposure control system and associated exposure control method | Chin-An Lin, Chung-Te Li, Keng-Sheng Lin, Hao Wang | 2017-01-24 |
| 9502519 | Semiconductor device and method for fabricating the same | Sheng-Hao Lin, Huai-Tzu Chiang, Hao-Ming Lee | 2016-11-22 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2016-09-20 |
| 9448217 | Gas sensing system | Hsiang-Chiu Wu, Shih-Wen Chiu, Ting-I Chou, Chia-Min Yang, Da-Jeng Yao +1 more | 2016-09-20 |
| 9431482 | Semiconductor structure | Sheng-Hao Lin, Huai-Tzu Chiang, Hao-Ming Lee | 2016-08-30 |
| 9415069 | Immunosuppressive cells and methods of making and using thereof | Shu-Ching Hsu, Hsin-Wei Chen, Pele Chong, Li WANG | 2016-08-16 |
| 9412653 | Through silicon via (TSV) process | Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai +2 more | 2016-08-09 |
| 9373575 | TSV structures and methods for forming the same | Yung-Chi Lin, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu, Jing-Cheng Lin | 2016-06-21 |
| 9316901 | Method for forming patterns | Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang | 2016-04-19 |
| 9312208 | Through silicon via structure | Home-Been Cheng, Yu-Han Tsai, Ching-Li Yang | 2016-04-12 |
| 9281400 | Method of fabricating a semiconductor device with fin-shaped structures | Huai-Tzu Chiang, Sheng-Hao Lin, Hao-Ming Lee, Tzyy-Ming Cheng | 2016-03-08 |
| 9274416 | Method for forming photo-mask and OPC method | Chun-Hsien Huang, Ming-Jui Chen, Chia-Wei Huang, Kai-Lin Chuang | 2016-03-01 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Yung-Chi Lin, Ku-Feng Yang +2 more | 2016-02-02 |
| 9215442 | Devices and methods for 3-D image processing | Chen-Kang Su | 2015-12-15 |
| 9147451 | Memory device and method of controlling leakage current within such a memory device | Yew Keong Chong, Sanjay Mangal | 2015-09-29 |
| 9146876 | Caching method and caching system using dual disks | Po-Wei Wu, Hsung-Pin Chang, Ta-Wei Chang | 2015-09-29 |
| 9136170 | Through silicon via (TSV) structure and process thereof | Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai +2 more | 2015-09-15 |
| 9131160 | Method for controlling exposure time of high dynamic range image | Keng-Sheng Lin, Chih-Chi Cheng, Chung-Te Li, Wen-Chu Yang | 2015-09-08 |
| 9112007 | Through via structure and method | Yung-Chi Lin, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2015-08-18 |
| 9099515 | Reconfigurable guide pin design for centering wafers having different sizes | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2015-08-04 |
| 9090452 | Mechanism for forming MEMS device | Shyh-Wei Cheng, Jui-Chun Weng, Hsi-Cheng Hsu, Chih-Yu Wang, Chuan-Yi Ko +5 more | 2015-07-28 |
| 9093314 | Copper bump structures having sidewall protection layers | Jing-Cheng Lin, Ya-Hsi Hwung, Po-Hao Tsai, Yan-Fu Lin, Cheng-Lin Huang +2 more | 2015-07-28 |
| 9059262 | Integrated circuits including conductive structures through a substrate and methods of making the same | Yuan-Hung Liu, Ku-Feng Yang, Pei-Ching Kuo, Ming-Tsu Chung, Tsang-Jiuh Wu +1 more | 2015-06-16 |