Issued Patents All Time
Showing 626–650 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9595482 | Structure for die probing | — | 2017-03-14 |
| 9589891 | Contact pad for semiconductor devices | Jie Chen, Ying-Ju Chen | 2017-03-07 |
| 9589903 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2017-03-07 |
| 9589938 | Semiconductor device including an embedded surface mount device and method of forming the same | Ying-Ju Chen | 2017-03-07 |
| 9589900 | Metal pad for laser marking | An-Jhih Su | 2017-03-07 |
| 9589862 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-03-07 |
| 9576926 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2017-02-21 |
| 9570322 | Integrated circuit packages and methods of forming same | An-Jhih Su | 2017-02-14 |
| 9570410 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2017-02-14 |
| 9570418 | Structure and method for package warpage control using dummy interconnects | Ying-Ju Chen | 2017-02-14 |
| 9564345 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, An-Jhih Su, Li-Hsien Huang | 2017-02-07 |
| 9559070 | Post-passivation interconnect structure and method of forming same | Yi-Wen Wu | 2017-01-31 |
| 9559067 | Methods and apparatus of guard rings for wafer-level-packaging | Tsung-Yuan Yu | 2017-01-31 |
| 9559044 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2017-01-31 |
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2017-01-31 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2017-01-24 |
| 9553066 | Post passivation interconnect structures and methods for forming the same | Ying-Ju Chen | 2017-01-24 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Yu-Feng Chen, Tsung-Shu Lin, Han-Ping Pu | 2017-01-24 |
| 9553053 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hung-An Teng +1 more | 2017-01-24 |
| 9553001 | Method of forming a molding layer for semiconductor package | Jie Chen | 2017-01-24 |
| 9541953 | Electronic assembly | Cheng-Nan Ling, Yi-Mu Chang, Chun-I Chen, Yu-Shih Wang | 2017-01-10 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hao-Yi Tsai, Ying-Ju Chen, Yu-Wen Liu | 2017-01-03 |
| 9535466 | Electronic assembly | Yi-Mu Chang, Yan-Lin Kuo, Cheng-Nan Ling, Chun-I Chen, Yu-Shih Wang +1 more | 2017-01-03 |
| 9536865 | Interconnection joints having variable volumes in package structures and methods of formation thereof | Hsuan-Ting Kuo, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen +1 more | 2017-01-03 |
| 9530757 | Single mask package apparatus | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo | 2016-12-27 |