Issued Patents All Time
Showing 576–600 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786519 | Packaged semiconductor devices and methods of packaging semiconductor devices | — | 2017-10-10 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9786614 | Integrated fan-out structure and method of forming | An-Jhih Su, Tsung-Shu Lin | 2017-10-10 |
| 9786635 | Integrated circuit package assembly | — | 2017-10-10 |
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2017-10-03 |
| 9773745 | Semiconductor device and manufacturing method thereof | Ying-Ju Chen | 2017-09-26 |
| 9773732 | Method and apparatus for packaging pad structure | Ching-Jung Yang, Chia-Wei Tu | 2017-09-26 |
| 9768133 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2017-09-19 |
| 9754910 | Methods of packaging semiconductor devices and packaged semiconductor devices | Jie Chen | 2017-09-05 |
| 9754928 | SMD, IPD, and/or wire mount in a package | Ming-Yen Chiu | 2017-09-05 |
| 9748720 | Transmission shaft set, transmission shaft structure and metal pin connecting shaft | Yi-Ta Huang, Wen-Chieh Tai, Yu-Shih Wang, Cheng-Nan Ling, Chun-I Chen | 2017-08-29 |
| 9741690 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2017-08-22 |
| 9741659 | Electrical connections for chip scale packaging | Shih-Wei Liang | 2017-08-22 |
| 9735134 | Packages with through-vias having tapered ends | — | 2017-08-15 |
| 9735129 | Semiconductor packages and methods of forming the same | Jie Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2017-08-15 |
| 9728522 | Integrated circuit packages and methods of forming same | An-Jhih Su | 2017-08-08 |
| 9728517 | Semiconductor device and manufacturing method thereof | Jie Chen | 2017-08-08 |
| 9728498 | Package structure | An-Jhih Su | 2017-08-08 |
| 9721933 | Laser marking in packages | — | 2017-08-01 |
| 9704739 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen | 2017-07-11 |
| 9698118 | Method and apparatus for connecting packages onto printed circuit boards | — | 2017-07-04 |
| 9691726 | Methods for forming fan-out package structure | Ming-Da Cheng, Cheng-Lin Huang, Meng-Tse Chen, Chung-Shi Liu | 2017-06-27 |
| 9685411 | Integrated circuit dies having alignment marks and methods of forming same | — | 2017-06-20 |
| 9679839 | Chip on package structure and method | An-Jhih Su, Der-Chyang Yeh | 2017-06-13 |
| 9679868 | Ball height control in bonding process | Tsung-Yuan Yu, Jie Chen | 2017-06-13 |