Issued Patents All Time
Showing 526–550 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953963 | Integrated circuit process having alignment marks for underfill | An-Jhih Su, Wei-Yu Chen | 2018-04-24 |
| 9947626 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2018-04-17 |
| 9947630 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2018-04-17 |
| 9941248 | Package structures, pop devices and methods of forming the same | Tien-Chung Yang, An-Jhih Su, Jo-Mei Wang, Wei-Yu Chen | 2018-04-10 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9935084 | Devices and methods of packaging semiconductor devices | Jie Chen | 2018-04-03 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2018-03-27 |
| 9929112 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2018-03-27 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2018-03-27 |
| 9929069 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, An-Jhih Su, Li-Hsien Huang | 2018-03-27 |
| 9922964 | Package structure with dummy die | Li-Hsien Huang | 2018-03-20 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, An-Jhih Su, Jo-Mei Wang, Tien-Chung Yang | 2018-03-20 |
| 9911707 | Structure and method of forming a pad structure having enhanced reliability | Ying-Ju Chen | 2018-03-06 |
| 9911687 | Molding compound structure | — | 2018-03-06 |
| 9911672 | Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices | Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Kuan-Chung Lu | 2018-03-06 |
| 9911667 | Structure for die probing | — | 2018-03-06 |
| 9881857 | Pad design for reliability enhancement in packages | Jie Chen | 2018-01-30 |
| 9859242 | Post-passivation interconnect structure and method of forming same | Yi-Wen Wu | 2018-01-02 |
| 9859223 | Dicing structures for semiconductor substrates and methods of fabrication thereof | — | 2018-01-02 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |
| 9859245 | Chip package structure with bump and method for forming the same | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2018-01-02 |
| 9859258 | Semiconductor device and method of manufacture | Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su | 2018-01-02 |
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Li-Hsien Huang, Yung-Shou Cheng, Yan-Fu Lin, An-Jhih Su, Wei-Cheng Wu +2 more | 2017-12-26 |
| 9852998 | Ring structures in device die | Ying-Ju Chen, Jie Chen | 2017-12-26 |