Issued Patents All Time
Showing 176–200 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037963 | Package structure and method of forming the same | Jie Chen, Chen-Hua Yu, Hsien-Wei Chen | 2018-07-31 |
| 10026704 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2018-07-17 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2018-06-12 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Shih-Peng Tai | 2018-05-29 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |
| 9960106 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2018-05-01 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2018-03-27 |
| 9922903 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2018-03-20 |
| 9911672 | Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices | Chi-Hsi Wu, Hsien-Wei Chen, Li-Hsien Huang, Kuan-Chung Lu | 2018-03-06 |
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Li-Hsien Huang, Yung-Shou Cheng, Yan-Fu Lin, An-Jhih Su, Wei-Cheng Wu +2 more | 2017-12-26 |
| 9842788 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2017-12-12 |
| 9831200 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Li-Hsien Huang | 2017-11-28 |
| 9818698 | EMI package and method for making same | Chuei-Tang Wang | 2017-11-14 |
| 9812337 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2017-11-07 |
| 9812381 | Integrated fan-out package and method of fabricating the same | Chi-Hsi Wu, Chun-Yi Liu, Hsien-Wei Chen, Shih-Peng Tai, Chuen-De Wang | 2017-11-07 |
| 9768133 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2017-09-19 |
| 9748189 | Multi-chip package structure and method of forming same | Jui-Pin Hung, Chen-Hua Yu, Jing-Cheng Lin | 2017-08-29 |
| 9741690 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2017-08-22 |
| 9735129 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen, Jie Chen, Shin-Puu Jeng, Chen-Hua Yu | 2017-08-15 |
| 9704826 | Chip on package structure and method | Chen-Hua Yu, Kuo-Chung Yee, Jui-Pin Hung | 2017-07-11 |
| 9685426 | Package-on-package semiconductor device | Chen-Hua Yu | 2017-06-20 |
| 9679839 | Chip on package structure and method | An-Jhih Su, Hsien-Wei Chen | 2017-06-13 |
| 9666522 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Shin-Puu Jeng, Chen-Hua Yu | 2017-05-30 |
| 9659863 | Semiconductor devices, multi-die packages, and methods of manufacture thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Shih-Peng Tai | 2017-05-23 |
| 9660016 | Method of manufacturing a capacitor | Chun Hua Chang, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2017-05-23 |