Issued Patents All Time
Showing 226–250 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9048222 | Method of fabricating interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2015-06-02 |
| 9040381 | Packages with passive devices and methods of forming the same | Chen-Hua Yu, Shang-Yun Hou, Shuo-Mao Chen, Chiung-Han Yeh, Yi-Jou Lin | 2015-05-26 |
| 8999179 | Conductive vias in a substrate | Chen-Hua Yu | 2015-04-07 |
| 8993380 | Structure and method for 3D IC package | Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2015-03-31 |
| 8993393 | Multiple silicide integration structure and method | Hsing-Kuo Hsia, Hao-Hsun Lin, Chih-Ping Chao, Chin-Hao Su, Hsi-Kuei Cheng | 2015-03-31 |
| 8937389 | Semiconductor devices comprising GSG interconnect structures | Christianto Chih-Ching Liu, Shuo-Mao Chen, Shang-Yun Hou, Shin-Puu Jeng | 2015-01-20 |
| 8927412 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Jui-Pin Hung | 2015-01-06 |
| 8928117 | Multi-chip package structure and method of forming same | Jui-Pin Hung, Chen-Hua Yu, Jing-Cheng Lin | 2015-01-06 |
| 8895385 | Methods of forming semiconductor structures | Chun Hua Chang, Sung-Hui Huang | 2014-11-25 |
| 8890224 | Semiconductor structures having a metal-insulator-metal capacitor structure | Chun Hua Chang, Sung-Hui Huang | 2014-11-18 |
| 8878338 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2014-11-04 |
| 8878369 | Low power/high speed TSV interface design | Chung-Hui Chen, Jaw-Juinn Horng, Shuo-Mao Chen | 2014-11-04 |
| 8872312 | EMI package and method for making same | Chuei-Tang Wang | 2014-10-28 |
| 8809996 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Li-Hsien Huang | 2014-08-19 |
| 8810006 | Interposer system and method | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou | 2014-08-19 |
| 8803306 | Fan-out package structure and methods for forming the same | Chen-Hua Yu | 2014-08-12 |
| 8765549 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Shin-Puu Jeng, Shang-Yun Hou, Wen-Chih Chiou | 2014-07-01 |
| 8680647 | Packages with passive devices and methods of forming the same | Chen-Hua Yu, Shang-Yun Hou, Shuo-Mao Chen, Chiung-Han Yeh, Yi-Jou Lin | 2014-03-25 |
| 8581347 | Forming bipolar transistor through fast EPI-growth on polysilicon | Li-Weng Chang, Hua-Chou Tseng, Chih-Ping Chao | 2013-11-12 |
| 8575717 | Integrated circuit device and method of manufacturing the same | Shang-Yun Hou | 2013-11-05 |
| 8552485 | Semiconductor structure having metal-insulator-metal capacitor structure | Chun Hua Chang, Sung-Hui Huang | 2013-10-08 |
| 8546953 | Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit | Jaw-Juinn Horng, Chia-Lin Yu, Chung-Hui Chen, Yung-Chow Peng | 2013-10-01 |
| 8338906 | Schottky device | Ping-Chun Yeh, Ruey-Hsin Liu, Mingo Liu | 2012-12-25 |
| 8334187 | Hard mask for thin film resistor manufacture | Li-Wen Chang, Chung-Yi Yu, Hsun-Chung Kuang, Hua-Chou Tseng, Chih-Ping Chao +2 more | 2012-12-18 |
| 8334579 | Schottky diode | Ping-Chun Yeh, Chih-Ping Chao | 2012-12-18 |