Issued Patents All Time
Showing 201–225 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653433 | Multi-chip structure and method of forming same | Chen-Hua Yu | 2017-05-16 |
| 9646955 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2017-05-09 |
| 9620482 | Semiconductor device and manufacturing method thereof | Yu-Jen Chen, Hsien-Wei Chen | 2017-04-11 |
| 9576926 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen | 2017-02-21 |
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu, Chien-Fu Tseng | 2017-01-31 |
| 9553070 | 3D packages and methods for forming the same | Chen-Hua Yu | 2017-01-24 |
| 9502386 | Fan-out package structure and methods for forming the same | Chen-Hua Yu | 2016-11-22 |
| 9502343 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Li-Han Hsu +1 more | 2016-11-22 |
| 9460987 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2016-10-04 |
| 9461020 | Semiconductor package including an embedded surface mount device and method of forming the same | Hsien-Wei Chen, Ming-Yen Chiu, Ying-Ju Chen | 2016-10-04 |
| 9461025 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2016-10-04 |
| 9449947 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2016-09-20 |
| 9418977 | Package-on-package semiconductor device | Chen-Hua Yu | 2016-08-16 |
| 9412678 | Structure and method for 3D IC package | Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2016-08-09 |
| 9391067 | Multiple silicide integration structure and method | Hsing-Kuo Hsia, Hao-Hsun Lin, Chih-Ping Chao, Chin-Hao Su, Hsi-Kuei Cheng | 2016-07-12 |
| 9373527 | Chip on package structure and method | Chen-Hua Yu, Kuo-Chung Yee, Jui-Pin Hung | 2016-06-21 |
| 9324698 | Multi-chip structure and method of forming same | Chen-Hua Yu | 2016-04-26 |
| 9305864 | Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit | Jaw-Juinn Horng, Chia-Lin Yu, Chung-Hui Chen, Yung-Chow Peng | 2016-04-05 |
| 9275950 | Bead for 2.5D/3D chip packaging application | Feng-Wei Kuo, Huan-Neng Chen, Chewn-Pu Jou, Chuei-Tang Wang | 2016-03-01 |
| 9275923 | Band pass filter for 2.5D/3D integrated circuit applications | Feng-Wei Kuo, Huan-Neng Chen, Chewn-Pu Jou, Shuo-Mao Chen | 2016-03-01 |
| 9263511 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Chiung-Han Yeh | 2016-02-16 |
| 9196586 | Semiconductor package including an embedded surface mount device and method of forming the same | Hsien-Wei Chen, Ying-Ju Chen, Ming-Yen Chiu | 2015-11-24 |
| 9129944 | Fan-out package structure and methods for forming the same | Chen-Hua Yu | 2015-09-08 |
| 9111896 | Package-on-package semiconductor device | Chen-Hua Yu | 2015-08-18 |
| 9111949 | Methods and apparatus of wafer level package for heterogeneous integration technology | Chen-Hua Yu | 2015-08-18 |