Issued Patents All Time
Showing 151–175 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283375 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2019-05-07 |
| 10276484 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2019-04-30 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |
| 10269619 | Wafer level chip scale packaging intermediate structure apparatus and method | Chen-Hua Yu | 2019-04-23 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2019-04-23 |
| 10177115 | Package structures and methods of forming | Chen-Hua Yu, Hsien-Wei Chen | 2019-01-08 |
| 10163661 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2018-12-25 |
| 10163803 | Integrated fan-out packages and methods of forming the same | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu | 2018-12-25 |
| 10163807 | Alignment pattern for package singulation | Ying-Ju Chen, Hsien-Wei Chen, Shih-Peng Tai | 2018-12-25 |
| 10163841 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Jui-Pin Hung | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Wei Chen, Li-Han Hsu +1 more | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2018-12-25 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Li-Han Hsu +1 more | 2018-12-18 |
| 10157899 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2018-12-18 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Wei-Cheng Wu | 2018-12-18 |
| 10153338 | Method of manufacturing a capacitor | Chun Hua Chang, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2018-12-11 |
| 10153205 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Chiung-Han Yeh | 2018-12-11 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu | 2018-11-27 |
| 10083940 | Package-on-package semiconductor device | Chen-Hua Yu | 2018-09-25 |
| 10074631 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, An-Jhih Su | 2018-09-11 |
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +2 more | 2018-08-28 |
| 10049898 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu, Chien-Fu Tseng | 2018-08-14 |
| 10037892 | Multi-chip structure and method of forming same | Chen-Hua Yu | 2018-07-31 |