Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754917 | Method of forming wafer-level molded structure for package assembly | Tsung-Ding Wang, Bo-I Lee | 2017-09-05 |
| 9721916 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Tsung-Ding Wang | 2017-08-01 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2017-06-27 |
| 9673158 | Formation of connectors without UBM | Tsung-Ding Wang, Hung-Jen Lin | 2017-06-06 |
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Kai-Ming Ching, Bo-I Lee | 2017-06-06 |
| 9653443 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii | 2017-05-16 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2017-05-16 |
| 9496189 | Stacked semiconductor devices and methods of forming same | Chen-Hua Yu, Tsung-Ding Wang, Jung Wei Cheng | 2016-11-15 |
| 9455236 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Tsung-Ding Wang, Jung Wei Cheng | 2016-09-27 |
| 9437551 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Tsung-Ding Wang | 2016-09-06 |
| 9397137 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Mirng-Ji Lii | 2016-07-19 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9343433 | Packages with stacked dies and methods of forming the same | Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-17 |
| 9337135 | Pop joint through interposer | Mirng-Ji Lii, Yu-Min Liang, Jiun Yi Wu | 2016-05-10 |
| 9318465 | Methods for forming a semiconductor device package | Jung Wei Cheng, Tsung-Ding Wang, Chun-Chih Chuang | 2016-04-19 |
| 9171790 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Yung Ching Chen, Jiun Yi Wu, Mirng-Ji Lii, Ming-Da Cheng | 2015-10-27 |
| 9165876 | Package-on-package structure and methods for forming the same | Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2015-10-20 |
| 9136211 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Pei-Haw Tsao, Kuo-Chin Chang, Chung-Yi Lin, Bill Kiang | 2015-09-15 |
| 9117939 | Method of forming wafer-level molded structure for package assembly | Tsung-Ding Wang, Bo-I Lee | 2015-08-25 |
| 9082765 | Bump-on-trace (BOT) structures and methods for forming the same | Chen-Hua Yu, Jiun Yi Wu | 2015-07-14 |
| 9006032 | Package on package structures and methods for forming the same | Jung Wei Cheng, Tsung-Ding Wang, Chun-Chih Chuang | 2015-04-14 |
| 8927877 | Looped interconnect structure | Hsin-An Shen, Yung Ching Chen, Ming-Chung Sung, Chih-Hang Tung, Da-Yuan Shih | 2015-01-06 |
| 8916956 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Jui-Pin Hung, Kai-Chiang Wu | 2014-12-23 |
| 8890274 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Mirng-Ji Lii | 2014-11-18 |
| 8796132 | System and method for forming uniform rigid interconnect structures | Ming-Chung Sung, Yung Ching Chen, Chen-Hua Yu, Mirng-Ji Lii | 2014-08-05 |