Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10530030 | Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-01-07 |
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng | 2019-12-31 |
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10515931 | System in package and method of fabricating same | Tsung-Ding Wang | 2019-12-24 |
| 10483132 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang | 2019-11-19 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2019-10-29 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2019-07-16 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Yu-Min Liang, Mirng-Ji Lii, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10141201 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen | 2018-11-27 |
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Mirng-Ji Lii | 2018-10-02 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang | 2018-09-11 |
| 10056267 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2018-08-21 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Tsung-Ding Wang, Jung Wei Cheng, Ming-Che Liu +2 more | 2018-07-17 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Yung Ching Chen, Chen-Hua Yu, Jiun Yi Wu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |
| 9985013 | Package-on-package structure and methods for forming the same | Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2018-05-29 |
| 9984999 | Packages with stacked dies and methods of forming the same | Dean Wang, Mirng-Ji Lii, Chen-Hua Yu | 2018-05-29 |
| 9935090 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Jung Wei Cheng, Tsung-Ding Wang | 2018-04-03 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Hung-Jen Lin, Jiun Yi Wu, Mirng-Ji Lii | 2018-04-03 |
| 9881898 | System in package process flow | Tsung-Ding Wang | 2018-01-30 |
| 9870946 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2018-01-16 |
| 9847320 | Semiconductor structure and method of fabricating the same | Chien-Hsun Chen, William Wu Shen, Jiun Yi Wu | 2017-12-19 |
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chen-Hua Yu, Chung-Shi Liu, Jung Wei Cheng, Ping-Kang Huang +2 more | 2017-11-21 |
| 9807867 | Interconnect structure and method of manufacturing the same | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-31 |
| 9786976 | Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-10 |
| 9768145 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Tsung-Ding Wang | 2017-09-19 |