Issued Patents All Time
Showing 51–75 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chi-Yang Yu, Hao-Cheng Hou, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2021-10-05 |
| 11127644 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng | 2021-09-21 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang | 2021-08-10 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2021-07-20 |
| 11006532 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2021-05-11 |
| 10957672 | Package structure and method of manufacturing the same | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2021-03-23 |
| 10937721 | Semiconductor structure | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2021-03-02 |
| 10916529 | Electronics card including multi-chip module | Chen-Hua Yu, Jiun Yi Wu | 2021-02-09 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Jiun Yi Wu, Chung-Shi Liu | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2021-01-05 |
| 10869385 | Semiconductor device, circuit board structure and method of fabricating the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-12-15 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2020-12-15 |
| 10854552 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-12-01 |
| 10825798 | Packages with stacked dies and methods of forming the same | Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2020-11-03 |
| 10804242 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Tsung-Ding Wang | 2020-10-13 |
| 10790210 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Yu-Min Liang | 2020-09-29 |
| 10785865 | Interconnect structure and method of manufacturing the same | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-09-22 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-09-08 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2020-07-14 |
| 10665520 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2020-05-26 |
| 10651055 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang | 2020-05-12 |
| 10638616 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-04-28 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2020-02-04 |