Issued Patents All Time
Showing 26–50 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11737205 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-08-22 |
| 11728217 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2023-08-15 |
| 11665834 | Electronic assembly having circuit carrier and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2023-05-30 |
| 11664566 | Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-05-30 |
| 11658164 | Electronics card including multi-chip module | Chen-Hua Yu, Jiun Yi Wu | 2023-05-23 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2023-05-23 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2023-05-23 |
| 11652086 | Packages with stacked dies and methods of forming the same | Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2023-05-16 |
| 11602056 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2023-03-07 |
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Hao-Cheng Hou, Wei-Yu Chen, Jung Wei Cheng, Tsung-Ding Wang, Chung-Shi Liu | 2022-12-27 |
| 11532587 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Jiun Yi Wu, Chung-Shi Liu | 2022-12-20 |
| 11488881 | Semiconductor device and method of manufacture | Chen-Hua Yu, Jiun Yi Wu | 2022-11-01 |
| 11457525 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-09-27 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2022-08-02 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen | 2022-07-12 |
| RE49045 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Yung Ching Chen | 2022-04-19 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11258151 | Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-02-22 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang | 2022-02-08 |
| 11217538 | Integrated circuit package and method | Chung-Shi Liu, Jiun Yi Wu | 2022-01-04 |
| 11217497 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2022-01-04 |
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Jiun Yi Wu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-16 |
| 11158614 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii | 2021-10-26 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2021-10-19 |