Issued Patents All Time
Showing 126–150 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su | 2018-12-25 |
| 10163853 | Formation method of chip package | Wen-Hsin Wei, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2018-12-25 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-18 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2018-12-18 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2018-12-18 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2018-12-11 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2018-11-27 |
| 10141253 | Semiconductor device and method | Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai | 2018-11-27 |
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2018-08-28 |
| 10062614 | FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Kuang-Hsin Chen | 2018-08-28 |
| 10049898 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2018-08-14 |
| 10026704 | Semiconductor package and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2018-07-17 |
| 9997629 | FinFET with high mobility and strain channel | Hou-Ju Li, Kao-Ting Lai, Kuo-Chiang Ting | 2018-06-12 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2018-06-12 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Der-Chyang Yeh, Shih-Peng Tai | 2018-05-29 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2018-05-22 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su | 2018-03-20 |
| 9911672 | Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices | Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Kuan-Chung Lu | 2018-03-06 |
| 9842788 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2017-12-12 |
| 9818720 | Structure and formation method for chip package | Wen-Hsin Wei, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-11-14 |
| 9812337 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2017-11-07 |
| 9812381 | Integrated fan-out package and method of fabricating the same | Chun-Yi Liu, Der-Chyang Yeh, Hsien-Wei Chen, Shih-Peng Tai, Chuen-De Wang | 2017-11-07 |
| 9805984 | FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Chen Kuang-Hsin | 2017-10-31 |