Issued Patents All Time
Showing 151–175 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806058 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-10-31 |
| 9768133 | Semiconductor package and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2017-09-19 |
| 9741690 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2017-08-22 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2017-08-15 |
| 9659863 | Semiconductor devices, multi-die packages, and methods of manufacture thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Der-Chyang Yeh, Shih-Peng Tai | 2017-05-23 |
| 9659810 | Method of making a FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Chen Kuang-Hsin | 2017-05-23 |
| 9653427 | Integrated circuit package with probe pad structure | Chen-Hua Yu, Hsiang-Fan Lee, Shih-Peng Tai, Tang-Jung Chiu, Wen-Chih Chiou | 2017-05-16 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, Szu-Po Huang, An-Jhih Su, Hsiang-Fan Lee +2 more | 2017-02-28 |
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2017-01-31 |
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su | 2016-12-20 |
| 9502343 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2016-11-22 |
| 9368628 | FinFET with high mobility and strain channel | Hou-Ju Li, Kao-Ting Lai, Kuo-Chiang Ting | 2016-06-14 |
| 9281254 | Methods of forming integrated circuit package | Chen-Hua Yu, Wen-Chih Chiou, Hsiang-Fan Lee, Shih-Peng Tai, Tang-Jung Chiu | 2016-03-08 |
| 8729634 | FinFET with high mobility and strain channel | Chun-Liang Shen, Kuo-Ching Tsai, Hou-Ju Li, Chun-Sheng Liang, Kao-Ting Lai +1 more | 2014-05-20 |
| 8697515 | Method of making a FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Kuang-Hsin Chen | 2014-04-15 |
| 8685853 | Dual damascene copper process using a selected mask | Fan-Chung Tseng, Wei-Ting Chien | 2014-04-01 |
| 8404538 | Device with self aligned stressor and method of making same | Kao-Ting Lai, Da-Wen Lin, Hsien-Hsin Lin, Yuan-Ching Peng | 2013-03-26 |
| 8071481 | Method for forming highly strained source/drain trenches | Ta-Wei Kao, Shiang-Bau Wang, Ming-Jie Huang, Shu-Yuan Ku | 2011-12-06 |
| 7989341 | Dual damascence copper process using a selected mask | Fan-Chung Tseng, Wei-Ting Chien | 2011-08-02 |
| 7732298 | Metal salicide formation having nitride liner to reduce silicide stringer and encroachment | Tan-Chen Lee, Chung-Te Lin, Kuang-Hsin Chen, Di-Houng Lee, Cheng-Hung Chang | 2010-06-08 |
| 7416953 | Vertical MIM capacitors and method of fabricating the same | Charles C. Lee | 2008-08-26 |
| 7205588 | Metal fuse for semiconductor devices | Shin-Puu Jeng, Shang-Yun Hou | 2007-04-17 |
| 7067359 | Method of fabricating an electrical fuse for silicon-on-insulator devices | — | 2006-06-27 |
| 6753210 | Metal fuse for semiconductor devices | Shin-Puu Jeng, Shang-Yun Hou | 2004-06-22 |
| 6713840 | Metal-insulator-metal device structure inserted into a low k material and the method for making same | Charles C. Lee | 2004-03-30 |