Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242883 | High aspect ratio etch of oxide metal oxide metal stack | Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Aaron Eppler, Thorsten Lill +2 more | 2019-03-26 |
| 9659783 | High aspect ratio etch with combination mask | Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Aaron Eppler, Thorsten Lill +2 more | 2017-05-23 |
| 9618846 | PECVD films for EUV lithography | Nader Shamma, Donald K. Schlosser | 2017-04-11 |
| 9418889 | Selective formation of dielectric barriers for metal interconnects in semiconductor devices | Hui-Jung Wu, Bhadri N. Varadarajan, Nagraj Shankar, William T. Lee | 2016-08-16 |
| 9379210 | Sacrificial pre-metal dielectric for self-aligned contact scheme | Bart J. van Schravendijk, Ananda Banerji, Nagraj Shankar | 2016-06-28 |
| 9304396 | PECVD films for EUV lithography | Nader Shamma, Don Schlosser | 2016-04-05 |
| 9230800 | Plasma activated conformal film deposition | Adrien LaVoie, Shankar Swaminathan, Hu Kang, Ramesh Chandrasekharan, Tom Dorsh +9 more | 2016-01-05 |
| 9190489 | Sacrificial pre-metal dielectric for self-aligned contact scheme | Bart J. van Schravendijk, Ananda Banerji, Nagraj Shankar | 2015-11-17 |
| 9018103 | High aspect ratio etch with combination mask | Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Aaron Eppler, Thorsten Lill +2 more | 2015-04-28 |
| 8728956 | Plasma activated conformal film deposition | Adrien LaVoie, Shankar Swaminathan, Hu Kang, Ramesh Chandrasekharan, Tom Dorsh +9 more | 2014-05-20 |
| 8298936 | Multistep method of depositing metal seed layers | Robert T. Rozbicki, Bart J. van Schravendijk, Wen Wu | 2012-10-30 |
| 8053861 | Diffusion barrier layers | Roey Shaviv, Steven T. Mayer, Ronald A. Powell | 2011-11-08 |
| 8030777 | Protection of Cu damascene interconnects by formation of a self-aligned buffer layer | Bart J. van Schravendijk, Mahesh K. Sanganeria, Glenn B. Alers, Roey Shaviv | 2011-10-04 |
| 7842604 | Low-k b-doped SiC copper diffusion barrier films | Yongsik Yu, Atul Gupta, Karen Billington, Michael Carris, William Crew | 2010-11-30 |
| 7531463 | Fabrication of semiconductor interconnect structure | Daniel A. Koos, Steven T. Mayer, Heung Lak Park, Timothy Cleary | 2009-05-12 |
| 7420275 | Boron-doped SIC copper diffusion barrier films | Yongsik Yu, Atul Gupta, Karen Billington, Michael Carris, William Crew | 2008-09-02 |
| 7396759 | Protection of Cu damascene interconnects by formation of a self-aligned buffer layer | Bart J. van Schravendijk, Mahesh K. Sanganeria, Glenn B. Alers, Roey Shaviv | 2008-07-08 |
| 7338908 | Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage | Daniel A. Koos, Steven T. Mayer, Heung Lak Park, Timothy Cleary | 2008-03-04 |
| 7239017 | Low-k B-doped SiC copper diffusion barrier films | Yongsik Yu, Atul Gupta, Karen Billington, Michael Carris, William Crew | 2007-07-03 |
| 6875699 | Method for patterning multilevel interconnects | Stephan Lassig, S. M. Reza Sadjadi, Vinay Pohray, Si Yi Li, Chiu Chi | 2005-04-05 |
| 6613199 | Apparatus and method for physical vapor deposition using an open top hollow cathode magnetron | Jeffrey Tobin, Jean Lu, Hong Mei Zhang | 2003-09-02 |
| 6265320 | Method of minimizing reactive ion etch damage of organic insulating layers in semiconductor fabrication | Jianou Shi, Mary Anne Plano, Joseph R. Laia, Jr. | 2001-07-24 |
| 6238751 | Chemical vapor deposition of low density silicon dioxide films | — | 2001-05-29 |
| 6200412 | Chemical vapor deposition system including dedicated cleaning gas injection | Michael D. Kilgore, Wilbert van den Hoek, Christopher J. Rau, Bart J. van Schravendijk, Jeffrey Tobin +1 more | 2001-03-13 |
| 6184572 | Interlevel dielectric stack containing plasma deposited fluorinated amorphous carbon films for semiconductor devices | Michael J. Shapiro | 2001-02-06 |