Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257718 | Contact structures | Chanro Park | 2022-02-22 |
| 10629699 | Gate height control and ILD protection | Andrew M. Greene, John R. Sporre, Ruilong Xie | 2020-04-21 |
| 10593599 | Contact structures | Chanro Park | 2020-03-17 |
| 10134633 | Self-aligned contact with CMP stop layer | Vimal Kamineni, Ruilong Xie | 2018-11-20 |
| 9923080 | Gate height control and ILD protection | Andrew M. Greene, John R. Sporre, Ruilong Xie | 2018-03-20 |
| 9865543 | Structure and method for inhibiting cobalt diffusion | Qiang Fang, Haigou Huang, John H. Zhang, Xingzhao Shi, Tai Fong Chao | 2018-01-09 |
| 9812365 | Methods of cutting gate structures on transistor devices | John H. Zhang, Haigou Huang, Xusheng Wu, Ruilong Xie | 2017-11-07 |
| 9238293 | Polishing pad edge extension | Chih-Hung Chen, Shou-Sung Chang | 2016-01-19 |
| 9138860 | Closed-loop control for improved polishing pad profiles | Sivakumar Dhandapani, Jun Qian, Christopher Cocca, Jason Garcheung Fung, Shou-Sung Chang +2 more | 2015-09-22 |
| 8758085 | Method for compensation of variability in chemical mechanical polishing consumables | Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk | 2014-06-24 |
| 8337279 | Closed-loop control for effective pad conditioning | Sivakumar Dhandapani, Daxin Mao, Sameer Deshpande, Shou-Sung Chang, Gregory E. Menk +4 more | 2012-12-25 |
| 8221193 | Closed loop control of pad profile based on metrology feedback | Shou-Sung Chang, Hung Chih Chen, Yuchun Wang | 2012-07-17 |
| 8096852 | In-situ performance prediction of pad conditioning disk by closed loop torque monitoring | Sameer Deshpande, Shou-Sung Chang, Hung Chih Chen, Roy C. Nangoy | 2012-01-17 |
| 7879255 | Method and composition for electrochemically polishing a conductive material on a substrate | Huyen Karen Tran, Renhe Jia, You Wang, Martin S. Wohlert, Daxin Mao | 2011-02-01 |
| 7842169 | Method and apparatus for local polishing control | Feng Q. Liu, Yan Wang, Rashid Mavliev, Liang-Yuh Chen, Alain Duboust | 2010-11-30 |
| 7699972 | Method and apparatus for evaluating polishing pad conditioning | Zhihong Wang, Yongqi Hu | 2010-04-20 |
| 7678245 | Method and apparatus for electrochemical mechanical processing | Yan Wang, Siew Neo, Feng Q. Liu, Yongqi Hu, Alain Duboust +9 more | 2010-03-16 |
| 7654885 | Multi-layer polishing pad | Shou-Sung Chang, Liang-Yuh Chen | 2010-02-02 |
| 7582564 | Process and composition for conductive material removal by electrochemical mechanical polishing | Zhihong Wang, You Wang, Daxin Mao, Renhe Jia, Yongqi Hu +2 more | 2009-09-01 |
| 7576007 | Method for electrochemically mechanically polishing a conductive material on a substrate | You Wang, Zhihong Wang, Renhe Jia, Yongqi Hu | 2009-08-18 |
| 7569134 | Contacts for electrochemical processing | Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev | 2009-08-04 |
| 7504018 | Electrochemical method for Ecmp polishing pad conditioning | You Wang, Lakshmanan Karuppiah, Jie Diao, Renhe Jia, Alpay Yilmaz | 2009-03-17 |
| 7446041 | Full sequence metal and barrier layer electrochemical mechanical processing | Feng Q. Liu, Liang-Yuh Chen, Yongqi Hu | 2008-11-04 |
| 7422516 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2008-09-09 |
| 7422982 | Method and apparatus for electroprocessing a substrate with edge profile control | You Wang, Jie Diao, Lakshmanan Karuppiah | 2008-09-09 |