Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2018-08-14 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-04-15 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-03-11 |
| 8324095 | Integration of ALD tantalum nitride for copper metallization | Hua Chung, Nirmalya Maity, Jick Yu, Mei Chang | 2012-12-04 |
| 7802480 | Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device | Steven Jay Randazzo | 2010-09-28 |
| 7604708 | Cleaning of native oxide with hydrogen-containing radicals | Bingxi Wood, Mark Kawaguchi, James S. Papanu, Chiukun Steven Lai, Chien-Teh Kao +2 more | 2009-10-20 |
| 7499255 | Vacuum-type electrical switching apparatus | James Francis Domo, Lance Sabados, Steven Jay Randazzo, Joseph E. Oeschger, Mary Montesclaros | 2009-03-03 |
| 7497122 | Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device | Mary Montesclaros, Steven Jay Randazzo, Bryce Sollazzi, Robert James Speciale | 2009-03-03 |
| 7383733 | Method and apparatus for the sonic detection of high pressure conditions in a vacuum switching device | Steven Jay Randazzo, Li Lei, Ernest F. Bestel | 2008-06-10 |
| 7313964 | Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device | Mary Montesclaros, Steven Jay Randazzo, Bryce Sollazzi, Robert James Speciale | 2008-01-01 |
| 7302854 | Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device | John C. Egermeier, Steven Jay Randazzo, Bryce Sollazzi | 2007-12-04 |
| 7048837 | End point detection for sputtering and resputtering | Sasson Somekh, Marc Schweitzer, John C. Forster, Zheng Xu, Barry Chin +1 more | 2006-05-23 |
| 7049226 | Integration of ALD tantalum nitride for copper metallization | Hua Chung, Nirmalya Maity, Jick Yu, Mei Chang | 2006-05-23 |
| 6933021 | Method of TiSiN deposition using a chemical vapor deposition (CVD) process | Jing-Pei (Connie) Chou, Chien-Teh Kao, Chiukin Lai, Mei Chang | 2005-08-23 |
| 6905965 | Reactive preclean prior to metallization for sub-quarter micron application | Suchitra Subrahmanyan, Liang-Yuh Chen | 2005-06-14 |
| 6743714 | Low temperature integrated metallization process and apparatus | Hong Mei Zhang, Fusen Chen, Ted Guo, Liang-Yuh Chen | 2004-06-01 |
| 6726776 | Low temperature integrated metallization process and apparatus | Hong Mei Zhang, Fusen Chen, Ted Guo | 2004-04-27 |
| 6693030 | Reactive preclean prior to metallization for sub-quarter micron application | Suchitra Subrahmanyan, Liang-Yuh Chen | 2004-02-17 |
| 6607976 | Copper interconnect barrier layer structure and formation method | Ling Chen, Seshadri Ganguli, Christophe Marcadal, Wei Cao, Mei Chang | 2003-08-19 |
| 6518176 | Method of selective formation of a barrier layer for a contact level via | Ted Guo, Liang-Yuh Chen, Suchitra Subrahmanyan | 2003-02-11 |
| 6509274 | Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate | Ted Guo, Jing-Pei (Connie) Chou, Liang-Yuh Chen | 2003-01-21 |
| 6500742 | Construction of a film on a semiconductor wafer | Chyi Chern, Michal Danek, Marvin Liao, Karl A. Littau, Ivo Raaijmakers +1 more | 2002-12-31 |
| 6458684 | Single step process for blanket-selective CVD aluminum deposition | Ted Guo, Liang-Yuh Chen, Mehul Naik | 2002-10-01 |
| 6444036 | Construction of a film on a semiconductor wafer | Chyi Chern, Michal Danek, Marvin Liao, Karl A. Littau, Ivo Raaijmakers +1 more | 2002-09-03 |
| 6436819 | Nitrogen treatment of a metal nitride/metal stack | Zhi ZHANG, David Pung, Nitin Khurana, Hong Mei Zhang | 2002-08-20 |