Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930540 | Electrostatic chuck assembly having a dielectric filler | Kartik Ramaswamy, Anwar Husain, Haitao Wang, Evans Lee, Jaeyong Cho +3 more | 2021-02-23 |
| 10546731 | Method, apparatus and system for wafer dechucking using dynamic voltage sweeping | Haitao Wang, Michael G. Chafin, Kartik Ramaswamy, Yue Guo, Valentin N. Todorow +3 more | 2020-01-28 |
| 10504765 | Electrostatic chuck assembly having a dielectric filler | Kartik Ramaswamy, Anwar Husain, Haitao Wang, Evans Lee, Jaeyong Cho +3 more | 2019-12-10 |
| 10410845 | Using bias RF pulsing to effectively clean electrostatic chuck (ESC) | Usama Dadu, Wonseok Lee, Daisuke Shimizu, Li Ling, Kevin Choi | 2019-09-10 |
| 9748366 | Etching oxide-nitride stacks using C4F6H2 | Jong Mun Kim, Li Ling, Jairaj Payyapilly, Srinivas D. Nemani, Daisuke Shimizu +1 more | 2017-08-29 |
| 9129911 | Boron-doped carbon-based hardmask etch processing | Jong Mun Kim, Daisuke Shimizu | 2015-09-08 |
| 8778207 | Plasma etch processes for boron-doped carbonaceous mask layers | Jong Mun Kim, Jairaj Payyapilly | 2014-07-15 |
| 8668837 | Method for etching substrate | Jong Mun Kim | 2014-03-11 |
| 8231799 | Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone | Kallol Bera, Xiaoye Zhao, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2012-07-31 |
| 7846846 | Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls | Kallol Bera, Stephan Wege, Subhash Deshmukh | 2010-12-07 |
| 7541292 | Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones | Kallol Bera, Xiaoye Zhao, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2009-06-02 |
| 7540971 | Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content | Kallol Bera, Xiaoye Zhao, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2009-06-02 |
| 7431859 | Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation | Kallol Bera, Xiaoye Zhao, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2008-10-07 |
| 7316761 | Apparatus for uniformly etching a dielectric layer | Yunsang Kim, Mahmoud Dahimene, Jingbao Liu, Bryan Pu, Hongqing Shan +1 more | 2008-01-08 |
| 7105442 | Ashable layers for reducing critical dimensions of integrated circuit features | Hongching Shan, Jingbao Liu, Michael Barnes, Hong Dang Nguyen, Christopher Dennis Bencher +4 more | 2006-09-12 |
| 6825618 | Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply | Bryan Pu, Hongching Shan, Claes Bjorkman, Mike Welch, Richard R. Mett | 2004-11-30 |
| 6686293 | Method of etching a trench in a silicon-containing dielectric material | Yunsang Kim, Claes Bjorkman, Hongqing Shan | 2004-02-03 |
| 6568346 | Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply | Bryan Pu, Hongching Shan, Claes Bjorkman, Mike Welch, Richard R. Mett | 2003-05-27 |
| 6403491 | Etch method using a dielectric etch chamber with expanded process window | Jingbao Liu, Judy Wang, Takehiko Komatsu, Bryan Pu, Claes Bjorkman +4 more | 2002-06-11 |
| 6273022 | Distributed inductively-coupled plasma source | Bryan Pu, Hongching Shan, Claes Bjorkman, Mike Welch, Richard R. Mett | 2001-08-14 |