Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721802 | LED based optical source coupled with plasma source | Joseph R. Johnson | 2017-08-01 |
| 9576810 | Process for etching metal using a combination of plasma and solid state sources | Joseph R. Johnson, Jingjing Liu, He Ren | 2017-02-21 |
| 9411237 | Resist hardening and development processes for semiconductor device manufacturing | Peng Xie, Christopher Dennis Bencher, Huixiong Dai, Timothy Michaelson | 2016-08-09 |
| 9378941 | Interface treatment of semiconductor surfaces with high density low energy plasma | Aneesh Nainani, Bhushan Zope, Leonid Dorf, Shahid Rauf, Adam Brand +1 more | 2016-06-28 |
| 8475625 | Apparatus for etching high aspect ratio features | Sharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly A. McDonough, Jivko Dinev +9 more | 2013-07-02 |
| 8080479 | Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-12-20 |
| 8076247 | Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-12-13 |
| 7968469 | Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-06-28 |
| 7884025 | Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-02-08 |
| 7879731 | Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-02-01 |
| 7846846 | Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls | Kallol Bera, Kenny L. Doan, Stephan Wege | 2010-12-07 |
| 7323116 | Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage | Timothy J. Guiney, Rao Annapragada, Chia-Cheng CHENG | 2008-01-29 |
| 7084070 | Treatment for corrosion in substrate processing | Sangheon Lee, Sean S. Kang, S M Reza Sadjadi, Ji Soo Kim | 2006-08-01 |
| 6271539 | Electrical diagnostic technique for silicon plasma-etch induced damage characterization | Mark Michael Nelson | 2001-08-07 |
| 6265729 | Method for detecting and characterizing plasma-etch induced damage in an integrated circuit | Mark Michael Nelson | 2001-07-24 |