Subhash Deshmukh — 15 Patents at Applied Materials

Subhash Deshmukh has been granted 15 US patents while listed as an inventor at Applied Materials. The first was granted in 2001 and the most recent in August 2017. Subhash Deshmukh ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Subhash Deshmukh in Livermore, CA, US.

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Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9721802	LED based optical source coupled with plasma source	Joseph R. Johnson	2017-08-01	$22,439,000
9576810	Process for etching metal using a combination of plasma and solid state sources	Joseph R. Johnson, Jingjing Liu, He Ren	2017-02-21	$36,475,000
9411237	Resist hardening and development processes for semiconductor device manufacturing	Peng Xie, Christopher Dennis Bencher, Huixiong Dai, Timothy Michaelson	2016-08-09	$15,983,000
9378941	Interface treatment of semiconductor surfaces with high density low energy plasma	Aneesh Nainani, Bhushan Zope, Leonid Dorf, Shahid Rauf, Adam Brand +1 more	2016-06-28	$9,817,000
8475625	Apparatus for etching high aspect ratio features	Sharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly A. McDonough, Jivko Dinev +9 more	2013-07-02	$11,179,000
8080479	Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator	Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more	2011-12-20	$23,410,000
8076247	Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes	Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more	2011-12-13	$5,494,000
7968469	Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity	Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more	2011-06-28	$3,915,000
7884025	Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources	Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more	2011-02-08	$15,045,000
7879731	Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources	Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more	2011-02-01	$7,897,000
7846846	Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls	Kallol Bera, Kenny L. Doan, Stephan Wege	2010-12-07	$3,240,000
7323116	Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage	Timothy J. Guiney, Rao Annapragada, Chia-Cheng CHENG	2008-01-29	$29,319,000
7084070	Treatment for corrosion in substrate processing	Sangheon Lee, Sean S. Kang, S M Reza Sadjadi, Ji Soo Kim	2006-08-01	$17,712,000
6271539	Electrical diagnostic technique for silicon plasma-etch induced damage characterization	Mark Michael Nelson	2001-08-07
6265729	Method for detecting and characterizing plasma-etch induced damage in an integrated circuit	Mark Michael Nelson	2001-07-24

Subhash Deshmukh — 15 Patents

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