| 9721802 |
LED based optical source coupled with plasma source |
Joseph R. Johnson |
2017-08-01 |
| 9576810 |
Process for etching metal using a combination of plasma and solid state sources |
Joseph R. Johnson, Jingjing Liu, He Ren |
2017-02-21 |
| 9411237 |
Resist hardening and development processes for semiconductor device manufacturing |
Peng Xie, Christopher Dennis Bencher, Huixiong Dai, Timothy Michaelson |
2016-08-09 |
| 9378941 |
Interface treatment of semiconductor surfaces with high density low energy plasma |
Aneesh Nainani, Bhushan Zope, Leonid Dorf, Shahid Rauf, Adam Brand +1 more |
2016-06-28 |
| 8475625 |
Apparatus for etching high aspect ratio features |
Sharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly A. McDonough, Jivko Dinev +9 more |
2013-07-02 |
| 8080479 |
Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator |
Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more |
2011-12-20 |
| 8076247 |
Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes |
Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more |
2011-12-13 |
| 7968469 |
Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity |
Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more |
2011-06-28 |
| 7884025 |
Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources |
Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more |
2011-02-08 |
| 7879731 |
Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources |
Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more |
2011-02-01 |
| 7846846 |
Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls |
Kallol Bera, Kenny L. Doan, Stephan Wege |
2010-12-07 |
| 7323116 |
Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage |
Timothy J. Guiney, Rao Annapragada, Chia-Cheng CHENG |
2008-01-29 |
| 7084070 |
Treatment for corrosion in substrate processing |
Sangheon Lee, Sean S. Kang, S M Reza Sadjadi, Ji Soo Kim |
2006-08-01 |
| 6271539 |
Electrical diagnostic technique for silicon plasma-etch induced damage characterization |
Mark Michael Nelson |
2001-08-07 |
| 6265729 |
Method for detecting and characterizing plasma-etch induced damage in an integrated circuit |
Mark Michael Nelson |
2001-07-24 |
