Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9660177 | Method to minimize MTJ sidewall damage and bottom electrode redeposition using IBE trimming | Yu-Jen Wang, Dongna Shen | 2017-05-23 |
| 8801947 | Methods for forming microlenses | Tinghao Wang, Cecilia Laura Quinteros, Linda Marquez, Steven M. Kennedy | 2014-08-12 |
| 7534363 | Method for providing uniform removal of organic material | Odette Turmel, Kenji Takeshita, Lily Zheng, Thomas S. Choi, David R. Pirkle | 2009-05-19 |
| 7323116 | Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage | Timothy J. Guiney, Subhash Deshmukh, Chia-Cheng CHENG | 2008-01-29 |
| 7202177 | Nitrous oxide stripping process for organosilicate glass | Helen Zhu | 2007-04-10 |
| 7129171 | Selective oxygen-free etching process for barrier materials | Helen Zhu | 2006-10-31 |
| 7081407 | Method of preventing damage to porous low-k materials during resist stripping | Kenji Takeshita | 2006-07-25 |
| 6916697 | Etch back process using nitrous oxide | Helen Zhu | 2005-07-12 |
| 6876063 | Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication | — | 2005-04-05 |
| 6828250 | Process for etching vias in organosilicate glass materials without causing RIE lag | William Frederick Bosch | 2004-12-07 |
| 6777344 | Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications | Ian J. Morey, Chok W. Ho | 2004-08-17 |
| 6700200 | Reliable via structures having hydrophobic inner wall surfaces | — | 2004-03-02 |
| 6630407 | Plasma etching of organic antireflective coating | Douglas Keil, Jim Bowers, Eric Wagganer, Tri C. Le | 2003-10-07 |
| 6543459 | Method of determining an end point for a remote microwave plasma cleaning system | — | 2003-04-08 |
| 6518174 | Combined resist strip and barrier etch process for dual damascene structures | Reza Sadjadi | 2003-02-11 |
| 6465365 | Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication | — | 2002-10-15 |
| 6418875 | Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication | — | 2002-07-16 |
| 6413877 | Method of preventing damage to organo-silicate-glass materials during resist stripping | — | 2002-07-02 |
| 6387797 | Method for reducing the capacitance between interconnects by forming voids in dielectric material | Subhas Bothra | 2002-05-14 |
| 6380092 | Gas phase planarization process for semiconductor wafers | Calvin T. Gabriel, Milind Weling | 2002-04-30 |
| 6303192 | Process to improve adhesion of PECVD cap layers in integrated circuits | Tekle M. Tafari, Subhas Bothra | 2001-10-16 |
| 6303525 | Method and structure for adhering MSQ material to liner oxide | — | 2001-10-16 |
| 6267076 | Gas phase planarization process for semiconductor wafers | Calvin T. Gabriel, Milind Weling | 2001-07-31 |
| 6255210 | Semiconductor dielectric structure and method for making the same | Milind Weling | 2001-07-03 |
| 6218735 | Process to improve adhesion of cap layers in intergrated circuits | — | 2001-04-17 |