Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6165905 | Methods for making reliable via structures having hydrophobic inner wall surfaces | — | 2000-12-26 |
| 6140221 | Method for forming vias through porous dielectric material and devices formed thereby | Subhas Bothra | 2000-10-31 |
| 6057245 | Gas phase planarization process for semiconductor wafers | Calvin T. Gabriel, Milind Weling | 2000-05-02 |
| 6048494 | Autoclave with improved heating and access | — | 2000-04-11 |
| 6028013 | Moisture repellant integrated circuit dielectric material combination | Samuel V. Dunton, Milind Weling, Subhas Bothra | 2000-02-22 |
| 6001747 | Process to improve adhesion of cap layers in integrated circuits | — | 1999-12-14 |