Issued Patents All Time
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331276 | Nonvolatile resistive memory element with an oxygen-gettering layer | Tony P. Chiang, Dipankar Pramanik | 2016-05-03 |
| 9246094 | Stacked bi-layer as the low power switchable RRAM | Yun Wang, Federico Nardi | 2016-01-26 |
| 9231203 | Doped narrow band gap nitrides for embedded resistors of resistive random access memory cells | Mihir Tendulkar | 2016-01-05 |
| 9224951 | Current-limiting electrodes | Yun Wang, Federico Nardi | 2015-12-29 |
| 8981332 | Nonvolatile resistive memory element with an oxygen-gettering layer | Tony P. Chiang, Dipankar Pramanik | 2015-03-17 |
| 8912518 | Resistive random access memory cells having doped current limiting layers | David Chi, Vidyut Gopal, Minh Huu Le, Minh Anh Nguyen, Dipankar Pramanik | 2014-12-16 |
| 8716135 | Method of eliminating a lithography operation | Judy Huckabay, Abdurrahman Sezginer | 2014-05-06 |
| 8679981 | Method for self-aligned doubled patterning lithography | Judy Huckabay, Abdurrahman Sezginer | 2014-03-25 |
| 8656321 | Method of eliminating a lithography operation | Judy Huckabay, Abdurrahman Sezginer | 2014-02-18 |
| 8440569 | Method of eliminating a lithography operation | Abdurrahman Sezginer | 2013-05-14 |
| 7856613 | Method for self-aligned doubled patterning lithography | Judy Huckabay, Abdurrahman Sezginer | 2010-12-21 |
| 7018282 | Customized polishing pad for selective process performance during chemical mechanical polishing | Charles Franklin Drill | 2006-03-28 |
| 6916525 | Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection | Subhas Bothra | 2005-07-12 |
| 6649253 | Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection | Subhas Bothra | 2003-11-18 |
| 6572439 | Customized polishing pad for selective process performance during chemical mechanical polishing | Charles Franklin Drill | 2003-06-03 |
| 6569757 | Methods for forming co-axial interconnect lines in a CMOS process for high speed applications | Subhas Bothra, Calvin T. Gabriel, Michael N. Misheloff | 2003-05-27 |
| 6545338 | Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applications | Subhas Bothra, Calvin T. Gabriel, Michael N. Misheloff | 2003-04-08 |
| 6410440 | Method and apparatus for a gaseous environment providing improved control of CMP process | Charles Franklin Drill | 2002-06-25 |
| 6387720 | Waveguide structures integrated with standard CMOS circuitry and methods for making the same | Michael N. Misheloff, Subhas Bothra, Calvin T. Gabriel | 2002-05-14 |
| 6380092 | Gas phase planarization process for semiconductor wafers | Rao Annapragada, Calvin T. Gabriel | 2002-04-30 |
| 6372522 | Use of optimized film stacks for increasing absorption for laser repair of fuse links | Subhas Bothra, Satyendra Sethi | 2002-04-16 |
| 6353261 | Method and apparatus for reducing interconnect resistance using an interconnect well | — | 2002-03-05 |
| 6319796 | Manufacture of an integrated circuit isolation structure | Olivier Laparra, Ramiro Solis, Hunter B. Brugge, Michela S. Love, Bijan Moslehi | 2001-11-20 |
| 6315645 | Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafers | Liming Zhang | 2001-11-13 |
| 6274940 | Semiconductor wafer, a chemical-mechanical alignment mark, and an apparatus for improving alignment for metal masking in conjunction with oxide and tungsten CMP | Daniel C. Baker, Charles Franklin Drill | 2001-08-14 |