Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6267076 | Gas phase planarization process for semiconductor wafers | Rao Annapragada, Calvin T. Gabriel | 2001-07-31 |
| 6255210 | Semiconductor dielectric structure and method for making the same | Rao Annapragada | 2001-07-03 |
| 6242805 | Method of using a polish stop film to control dishing during copper chemical mechanical polishing | — | 2001-06-05 |
| 6214734 | Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection | Subhas Bothra | 2001-04-10 |
| 6211087 | Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer | Calvin T. Gabriel | 2001-04-03 |
| 6196900 | Ultrasonic transducer slurry dispenser | Liming Zhang, Samuel V. Dunton | 2001-03-06 |
| 6193860 | Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents | — | 2001-02-27 |
| 6139428 | Conditioning ring for use in a chemical mechanical polishing machine | Charles Franklin Drill | 2000-10-31 |
| 6114246 | Method of using a polish stop film to control dishing during copper chemical mechanical polishing | — | 2000-09-05 |
| 6057245 | Gas phase planarization process for semiconductor wafers | Rao Annapragada, Calvin T. Gabriel | 2000-05-02 |
| 6034434 | Optimized underlayer structures for maintaining chemical mechanical polishing removal rates | Subhas Bothra | 2000-03-07 |
| 6028013 | Moisture repellant integrated circuit dielectric material combination | Rao Annapragada, Samuel V. Dunton, Subhas Bothra | 2000-02-22 |
| 6022265 | Complementary material conditioning system for a chemical mechanical polishing machine | Charles Franklin Drill, Calvin T. Gabriel, Richard Russ, David E. Henderson | 2000-02-08 |
| 6013558 | Silicon-enriched shallow trench oxide for reduced recess during LDD spacer etch | Ian Robert Harvey, Calvin T. Gabriel | 2000-01-11 |
| 5965941 | Use of dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing | Subhas Bothra, Calvin T. Gabriel | 1999-10-12 |
| 5952241 | Method and apparatus for improving alignment for metal masking in conjuction with oxide and tungsten CMP | Daniel C. Baker, Charles Franklin Drill | 1999-09-14 |
| 5953612 | Self-aligned silicidation technique to independently form silicides of different thickness on a semiconductor device | Xi-Wei Lin | 1999-09-14 |
| 5910022 | Method and system for tungsten chemical mechanical polishing for unplanarized dielectric surfaces | — | 1999-06-08 |
| 5861342 | Optimized structures for dummy fill mask design | Calvin T. Gabriel | 1999-01-19 |
| 5783488 | Optimized underlayer structures for maintaining chemical mechanical polishing removal rates | Subhas Bothra | 1998-07-21 |
| 5757502 | Method and a system for film thickness sample assisted surface profilometry | — | 1998-05-26 |
| 5653622 | Chemical mechanical polishing system and method for optimization and control of film removal uniformity | Charles Franklin Drill | 1997-08-05 |
| 5639697 | Dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing | Subhas Bothra, Calvin T. Gabriel | 1997-06-17 |
| 5618757 | Method for improving the manufacturability of the spin-on glass etchback process | Subhas Bothra | 1997-04-08 |
| 5540958 | Method of making microscope probe tips | Subhas Bothra | 1996-07-30 |