Issued Patents All Time
Showing 76–100 of 360 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600696 | Sub-fin leakage reduction for template strained materials | Rishabh Mehandru, Stephen M. Cea, Anupama Bowonder, Juhyung Nam | 2023-03-07 |
| 11594533 | Stacked trigate transistors with dielectric isolation between first and second semiconductor fins | Cheng-Ying Huang, Gilbert Dewey, Aaron D. Lilak, Patrick Morrow, Anh Phan +2 more | 2023-02-28 |
| 11574910 | Device with air-gaps to reduce coupling capacitance and process for forming such | Abhishek A. Sharma, Van H. Le, Travis W. Lajoie, Urusa Alaan, Hui Jae Yoo +2 more | 2023-02-07 |
| 11573798 | Stacked transistors with different gate lengths in different device strata | Aaron D. Lilak, Gilbert Dewey, Rishabh Mehandru, Ehren Mannebach, Cheng-Ying Huang +2 more | 2023-02-07 |
| 11569243 | Stacked-substrate DRAM semiconductor devices | Abhishek A. Sharma, Ravi Pillarisetty, Gilbert Dewey, Jack T. Kavalieros | 2023-01-31 |
| 11569238 | Vertical memory cells | Aaron D. Lilak, Gilbert Dewey, Kimin Jun, Hui Jae Yoo, Patrick Morrow +5 more | 2023-01-31 |
| 11569233 | Techniques and mechanisms for operation of stacked transistors | Ravi Pillarisetty, Marko Radosavljevic, Van H. Le, Jack T. Kavalieros | 2023-01-31 |
| 11563119 | Etchstop regions in fins of semiconductor devices | Cheng-Ying Huang, Gilbert Dewey, Erica J. Thompson, Aaron D. Lilak, Jack T. Kavalieros | 2023-01-24 |
| 11557658 | Transistors with high density channel semiconductor over dielectric material | Gilbert Dewey, Sean T. Ma, Tahir Ghani, Cheng-Ying Huang, Anand S. Murthy +3 more | 2023-01-17 |
| 11552104 | Stacked transistors with dielectric between channels of different device strata | Aaron D. Lilak, Gilbert Dewey, Rishabh Mehandru, Ehren Mannebach, Cheng-Ying Huang +3 more | 2023-01-10 |
| 11532619 | Transistor structures including a non-planar body having variable and complementary semiconductor and insulator portions | Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Caleb BARRETT, Jay P. Gupta +7 more | 2022-12-20 |
| 11532719 | Transistors on heterogeneous bonding layers | Kimin Jun, Jack T. Kavalieros, Gilbert Dewey, Aaron D. Lilak, Brennen Mueller +5 more | 2022-12-20 |
| 11515402 | Microelectronic transistor source/drain formation using angled etching | Seung Hoon Sung, Robert Turkot, Marko Radosavljevic, Han Wui Then, Sansaptak Dasgupta +1 more | 2022-11-29 |
| 11508577 | Channel layer formation for III-V metal-oxide-semiconductor field effect transistors (MOSFETs) | Gilbert Dewey, Matthew V. Metz, Sean T. Ma, Nicholas G. Minutillo, Cheng-Ying Huang +4 more | 2022-11-22 |
| 11482621 | Vertically stacked CMOS with upfront M0 interconnect | Patrick Morrow, Aaron D. Lilak, Rishabh Mehandru, Cheng-Ying Huang, Gilbert Dewey +4 more | 2022-10-25 |
| 11482614 | Quantum dot devices | Ravi Pillarisetty, Kanwaljit Singh, Nicole K. Thomas, Hubert C. George, Zachary R. Yoscovits +4 more | 2022-10-25 |
| 11476338 | Aluminum indium phosphide subfin germanium channel transistors | Matthew V. Metz, Harold W. Kennel, Van H. Le, Benjamin Chu-Kung, Jack T. Kavalieros +1 more | 2022-10-18 |
| 11469323 | Ferroelectric gate stack for band-to-band tunneling reduction | Gilbert Dewey, Jack T. Kavalieros, Cheng-Ying Huang, Matthew V. Metz, Sean T. Ma +2 more | 2022-10-11 |
| 11469766 | Digital-to-analog converters having multiple-gate transistor-like structure | Abhishek A. Sharma, Ravi Pillarisetty, Charles C. Kuo | 2022-10-11 |
| 11462568 | Stacked thin film transistors | Aaron D. Lilak, Justin R. Weber, Harold W. Kennel, Gilbert Dewey, Van H. Le +3 more | 2022-10-04 |
| 11450527 | Engineering tensile strain buffer in art for high quality Ge channel | Van H. Le, Benjamin Chu-Kung, Marc C. French, Seung Hoon Sung, Jack T. Kavalieros +2 more | 2022-09-20 |
| 11444159 | Field effect transistors with wide bandgap materials | Sean T. Ma, Gilbert Dewey, Matthew V. Metz, Cheng-Ying Huang, Harold W. Kennel +3 more | 2022-09-13 |
| 11437405 | Transistors stacked on front-end p-type transistors | Gilbert Dewey, Patrick Morrow, Aaron D. Lilak, Anh Phan, Ehren Mannebach +4 more | 2022-09-06 |
| 11437283 | Backside contacts for semiconductor devices | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more | 2022-09-06 |
| 11430814 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Gilbert Dewey, Jessica M. Torres +6 more | 2022-08-30 |