Issued Patents All Time
Showing 126–150 of 205 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8237286 | Integrated circuit interconnect structure | Hanyi Ding, Ronald G. Filippi, Jong-Ru Guo | 2012-08-07 |
| 8232646 | Interconnect structure for integrated circuits having enhanced electromigration resistance | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Chao-Kun Hu +2 more | 2012-07-31 |
| 8232115 | Test structure for determination of TSV depth | Hanyi Ding, Kai D. Feng, Zhijian Yang | 2012-07-31 |
| 8211756 | 3D chip-stack with fuse-type through silicon via | Kai D. Feng, Louis L. Hsu, Zhijian Yang | 2012-07-03 |
| 8193575 | Flash memory structure with enhanced capacitive coupling coefficient ratio (CCCR) and method for fabrication thereof | Louis C. Hsu, Xu Ouyang, Zhijian Yang | 2012-06-05 |
| 8178945 | Programmable PN anti-fuse | Robert C. Wong, Haining Yang | 2012-05-15 |
| 8164190 | Structure of power grid for semiconductor devices and method of making the same | Ronald G. Filippi, Wai-Kin Li | 2012-04-24 |
| 8159814 | Method of operating transistors and structures thereof for improved reliability and lifetime | Zhijian Yang, Fernando Guarin, J. Edwin Hostetter, Kai D. Feng | 2012-04-17 |
| 8158014 | Multi-exposure lithography employing differentially sensitive photoresist layers | Wu-Song Huang, Wai-Kin Li | 2012-04-17 |
| 8159040 | Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor | Douglas D. Coolbaugh, Ebenezer E. Eshun, Ephrem G. Gebreselasie, Zhong-Xiang He, Herbert L. Ho +8 more | 2012-04-17 |
| 8159247 | Yield enhancement for stacked chips through rotationally-connecting-interposer | Oleg Gluschenkov, Muthukumarasamy Karthikeyan, Yunsheng Song, Tso-Hui Ting, Richard P. Volant | 2012-04-17 |
| 8141101 | Minimizing message flow wait time for management user exits in a message broker application | Hang Xiao, Jean X. Yu | 2012-03-20 |
| 8138603 | Redundancy design with electro-migration immunity | Louis L. Hsu, Conal E. Murray, Chih-Chao Yang | 2012-03-20 |
| 8138083 | Interconnect structure having enhanced electromigration reliability and a method of fabricating same | Chih-Chao Yang, Yun-Yu Wang | 2012-03-20 |
| 8115575 | Active inductor for ASIC application | Louis L. Hsu, Jong-Ru Guo, Zhijian Yang | 2012-02-14 |
| 8098536 | Self-repair integrated circuit and repair method | Louis L. Hsu, Rajiv V. Joshi, Zhijian Yang | 2012-01-17 |
| 8089160 | IC interconnect for high current | Kimball M. Watson, Kai Xiu | 2012-01-03 |
| 8039314 | Metal adhesion by induced surface roughness | Danielle DeGraw, Peter J. Lindgren, Da-Yuan Shih | 2011-10-18 |
| 8030113 | Thermoelectric 3D cooling | Louis L. Hsu, Xiaojin Wei, Huilong Zhu | 2011-10-04 |
| 8003474 | Electrically programmable fuse and fabrication method | Kaushik Chanda, Ronald G. Filippi, Joseph M. Lukaitis | 2011-08-23 |
| 7979440 | System and article of manufacture for efficient evaluation of index screening predicates | You-Chin Fuh, Li Xia, Binghua Zhen | 2011-07-12 |
| 7961032 | Method of and structure for recovering gain in a bipolar transistor | Zhijian Yang, Kai D. Feng | 2011-06-14 |
| 7930664 | Programmable through silicon via | Kai D. Feng, Louis L. Hsu, Zhijian Yang | 2011-04-19 |
| 7919834 | Edge seal for thru-silicon-via technology | Robert Edgar Davis, Robert D. Edwards, J. Edwin Hostetter, Kimball M. Watson | 2011-04-05 |
| 7911263 | Leakage current mitigation in a semiconductor device | Jong-Ru Guo, Louis L. Hsu, Rajiv V. Joshi, Zhijian Yang | 2011-03-22 |