Issued Patents All Time
Showing 101–125 of 205 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8669786 | Clock phase shift detector | Kai D. Feng, Jong-Ru Guo, Trushil N. Shah, Zhijian Yang | 2014-03-11 |
| 8638124 | Clock phase shift detector | Kai D. Feng, Jon-ru Guo, Trushil N. Shah, Zhijian Yang | 2014-01-28 |
| 8633707 | Stacked via structure for metal fuse applications | Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Stephan Grunow, Naftali E. Lustig +1 more | 2014-01-21 |
| 8624395 | Redundancy design with electro-migration immunity and method of manufacture | Louis L. Hsu, Conal E. Murray, Chih-Chao Yang | 2014-01-07 |
| 8592947 | Thermally controlled refractory metal resistor | Joseph M. Lukaitis, Deborah M. Massey, Timothy D. Sullivan, Kimball M. Watson | 2013-11-26 |
| 8535991 | Methods and systems involving electrically reprogrammable fuses | Kaushik Chanda, Lynne M. Gignac, Wai-Kin Li | 2013-09-17 |
| 8530319 | Vertical silicide e-fuse | Ephrem G. Gebreselasie, Joseph M. Lukaitis, Robert R. Robison, William R. Tonti | 2013-09-10 |
| 8525549 | Physical unclonable function cell and array | Kai D. Feng, Hailing Wang, Zhijian Yang | 2013-09-03 |
| 8493075 | Method and apparatus for preventing circuit failure | Kai D. Feng, Jong-Ru Guo, Zhijian Yang | 2013-07-23 |
| 8465657 | Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability | Kaushik Chanda, James J. Demarest, Ronald G. Filippi, Roy Iggulden, Edward W. Kiewara +1 more | 2013-06-18 |
| 8455351 | Method of forming an integrated circuit interconnect structure | Hanyi Ding, Ronald G. Filippi, Jong-Ru Guo | 2013-06-04 |
| 8450205 | Redundancy design with electro-migration immunity and method of manufacture | Louis L. Hsu, Conal E. Murray, Chih-Chao Yang | 2013-05-28 |
| 8446014 | Integrated circuit interconnect structure | Hanyi Ding, Ronald G. Filippi, Jong-Ru Guo | 2013-05-21 |
| 8420537 | Stress locking layer for reliable metallization | Kaushik Chanda, Ronald G. Filippi, Charles C. Goldsmith, Chih-Chao Yang | 2013-04-16 |
| 8422322 | Self-repair integrated circuit and repair method | Louis L. Hsu, Rajiv V. Joshi, Zhijian Yang | 2013-04-16 |
| 8386605 | Accessing of sample portions of a large digital file preliminary to the access of the entire file | Li Ge, Hui Jiang, Yu Tang | 2013-02-26 |
| 8378447 | Electrically programmable fuse and fabrication method | Kaushik Chanda, Ronald G. Filippi, Joseph M. Lukaitis | 2013-02-19 |
| 8349723 | Structure of power grid for semiconductor devices and method of making the same | Ronald G. Filippi, Wai-Kin Li | 2013-01-08 |
| 8304863 | Electromigration immune through-substrate vias | Ronald G. Filippi, John A. Fitzsimmons, Kevin Kolvenbach | 2012-11-06 |
| 8299809 | In-line characterization of a device under test | Tso-Hui Ting, Mohammed I. Younus | 2012-10-30 |
| 8299567 | Structure of metal e-fuse | Chunyan E. Tian, Ronald G. Filippi, Wai-Kin Li | 2012-10-30 |
| 8274301 | On-chip accelerated failure indicator | Kai D. Feng, Thomas J. Fleischman, Xiaojin Wei, Zhijian Yang | 2012-09-25 |
| 8271590 | Processing electronic messages according to sender classification | Marc Dreyfus, Derek Lam, Michael Muller, Asima Silva, Robert C. Weir | 2012-09-18 |
| 8237278 | Configurable interposer | Oleg Gluschenkov, Yunsheng Song, Tso-Hui Ting | 2012-08-07 |
| 8237283 | Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices | Kaushik Chandra, Ronald G. Filippi, Wai-Lin Li, Chih-Chao Yang | 2012-08-07 |