Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8237283 | Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices | Kaushik Chandra, Ronald G. Filippi, Ping-Chuan Wang, Chih-Chao Yang | 2012-08-07 |