Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8716101 | Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices | Ronald G. Filippi, Wai-Kin Li, Ping-Chuan Wang, Chih-Chao Yang | 2014-05-06 |
| 8237283 | Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices | Ronald G. Filippi, Wai-Lin Li, Ping-Chuan Wang, Chih-Chao Yang | 2012-08-07 |