PJ

Paul C. Jamison

IBM: 65 patents #1,172 of 70,183Top 2%
TL Tokyo Electron Limited: 4 patents #1,723 of 5,567Top 35%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
Canon: 1 patents #14,899 of 19,416Top 80%
📍 Hopewell Junction, NY: #17 of 648 inventorsTop 3%
🗺 New York: #1,127 of 115,490 inventorsTop 1%
Overall (All Time): #30,942 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 51–68 of 68 patents

Patent #TitleCo-InventorsDate
7242055 Nitrogen-containing field effect transistor gate stack containing a threshold voltage control layer formed via deposition of a metal oxide Nestor A. Bojarczuk, Cyril Cabral, Jr., Eduard A. Cartier, Martin M. Frank, Evgeni Gousev +4 more 2007-07-10
7189431 Method for forming a passivated metal layer Hideaki Yamasaki, Kazuhito Nakamura, Yumiko Kawano, Gert Leusink, Fenton R. McFeely 2007-03-13
7169674 Complementary metal oxide semiconductor (CMOS) gate stack with high dielectric constant gate dielectric and integrated diffusion barrier Nestor A. Bojarczuk, Kevin K. Chan, Christopher P. D'Emic, Evgeni Gousev, Supratik Guha +1 more 2007-01-30
7115959 Method of forming metal/high-k gate stacks with high mobility Wanda Andreoni, Alessandro C. Callegari, Eduard A. Cartier, Alessandro Curioni, Christopher P. D'Emic +9 more 2006-10-03
7109559 Nitrided ultra thin gate dielectrics Mukesh V. Khare, Christopher P. D'Emic, Thomas T. Hwang, James J. Quinlivan, Beth Ward 2006-09-19
6982230 Deposition of hafnium oxide and/or zirconium oxide and fabrication of passivated electronic structures Cyril Cabral, Jr., Alessandro C. Callegari, Michael A. Gribelyuk, Dianne L. Lacey, Fenton R. McFeely +4 more 2006-01-03
6974779 Interfacial oxidation process for high-k gate dielectric process integration David L. O'Meara, Cory Wajda, Tsuyoshi Takahashi, Alessandro C. Callegari, Kristen Scheer +1 more 2005-12-13
6921711 Method for forming metal replacement gate of high performance Cyril Cabral, Jr., Victor Ku, Ying Li, Vijay Narayanan, An Steegen +2 more 2005-07-26
6893979 Method for improved plasma nitridation of ultra thin gate dielectrics Mukesh V. Khare, Christopher P. D'Emic, Thomas T. Hwang, James J. Quinlivan, Beth Ward 2005-05-17
6891231 Complementary metal oxide semiconductor (CMOS) gate stack with high dielectric constant gate dielectric and integrated diffusion barrier Nestor A. Bojarczuk, Kevin K. Chan, Christopher P. D'Emic, Evgeni Gousev, Supratik Guha +1 more 2005-05-10
6784485 Diffusion barrier layer and semiconductor device containing same Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac +5 more 2004-08-31
6573197 Thermally stable poly-Si/high dielectric constant material interfaces Alessandro C. Callegari, Evgeni Gousev, Michael A. Gribelyuk, Dianne L. Lacey 2003-06-03
6511876 High mobility FETS using A1203 as a gate oxide Douglas A. Buchanan, Alessandro C. Callegari, Michael A. Gribelyuk, Deborah A. Neumayer 2003-01-28
6500772 Methods and materials for depositing films on semiconductor substrates Ashima B. Chakravarti, Richard A. Conti, Chester T. Dziobkowski, Thomas Ivers, Frank V. Liucci 2002-12-31
6355567 Retrograde openings in thin films Scott D. Halle, David E. Kotecki, Richard S. Wise 2002-03-12
6348419 Modification of the wet characteristics of deposited layers and in-line control Frank Grellner, Glen L. Miles, David C. Mosher, Emmanuel Batt 2002-02-19
6345399 Hard mask process to prevent surface roughness for selective dielectric etching Tina Wagner, Richard S. Wise, Hongwen Yan 2002-02-12
6252295 Adhesion of silicon carbide films Donna R. Cote, Daniel C. Edelstein, John A. Fitzsimmons, Thomas Ivers, Ernest N. Levine 2001-06-26